Micro device transfer head heater assembly and method of transferring a micro device
AssigneeApple Inc.
InventorsAndreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Abstract
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Claims16
A method comprising:
- transferring heat from a heater assembly through a base substrate and to an array of transfer heads supported by the base substrate;
- picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly including the heater assembly and the base substrate supporting the array of electrostatic transfer heads;
- contacting a receiving substrate with the array of micro devices, wherein the array of electrostatic transfer heads are at a temperature above 156.7° C. while initially contacting the receiving substrate with the array of micro devices;
- and
- releasing the array of micro devices onto the receiving substrate.
Dependencies are inferred from the claim text.