# US 10,121,820 B1 · Protective caps for small image sensor masking and mounting process > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,820 B1 - Document ID: US10121820B1 - Status: Granted - Kind: B1 - Application number: 15/655,494 - Filed: 2017-07-20 - Granted: 2018-11-06 - Earliest claimed: 2017-07-20 - Assignees: OmniVision Technologies, Inc. - Applicants: OmniVision Technologies, Inc. - Inventors: Teng-Sheng Chen; Yuan-Wen Cheng; Chia-Yang Chang; Yi Qin; Wen-Jian Xia - Web page: https://patentgrep.com/patent/US10121820B1 ## CPC - H10F 39/024: {of coatings or optical elements} - A61B 1/0011: {Manufacturing of endoscope parts} - A61B 1/00163: {Optical arrangements (A61B1/002, A61B1/06 take precedence)} - A61B 1/051: {Details of CCD assembly} - H10F 39/018: {of hybrid image sensors} - H10F 39/182: {Colour image sensors} - H10F 39/804: {Containers or encapsulations} - H10F 39/8057: {Optical shielding} - H10F 39/8063: {Microlenses} - H10F 39/809: {of hybrid image sensors} - A61B 1/044: {for absorption imaging} - H10F 39/811: {Interconnections} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) ## Abstract A method of processing an image sensor system, comprising steps of placing a first cover member on top of an image sensor; coating the image sensor and the first cover member with a dark coating agent; removing the first cover member from the image sensor; placing a second cover member on top of the image sensor; affixing the image sensor on to a permanent mount to form an electrical coupling between the image sensor and the permanent mount; removing the second cover member from the image sensor; wherein the first cover member completely covers a top portion of the image sensor; and wherein the second cover member includes an internal rib configured to form a contact seal with the image sensor. ## Claims ### Claim 1 A method of processing an image sensor system, comprising steps of: (a) placing a first cover member on top of an image sensor; (b) coating the image sensor and the first cover member with a dark coating agent; (c) removing the first cover member from the image sensor; (d) placing a second cover member on top of the image sensor; (e) affixing the image sensor on to a permanent mount to form an electrical coupling between the image sensor and the permanent mount; (f) removing the second cover member from the image sensor; wherein the first cover member completely covers a top portion of the image sensor; and wherein the second cover member includes an internal rib configured to form a contact seal with the image sensor. ### Claim 2 (depends on 1) The method of claim 1, further comprising a step of affixing the image sensor on to a first temporary mount, before step (a). ### Claim 3 (depends on 2) The method of claim 2, further comprising a step of cutting and marking the image sensor, between step (b) and step (c). ### Claim 4 (depends on 2) The method of claim 2, further comprising a step of removing the image sensor from the first temporary mount, between step (c) and step (d). ### Claim 5 (depends on 4) The method of claim 4, further comprising a step of affixing the image sensor on to a second temporary mount, immediately after the step of removing the image sensor from the first temporary mount, and before step (d). ### Claim 6 (depends on 5) The method of claim 5, further comprising a step of removing the image sensor from the second temporary mount, between step (d) and step (e). ### Claim 7 (depends on 1) The method of claim 1, further comprising a step of placing a sheath over the image sensor, after step (e). ### Claim 8 (depends on 1) The method of claim 1, wherein after step (b), the small image sensor includes a first portion that is not coated with the dark coating agent, and a second portion that is coated with the dark coating agent. ### Claim 9 (depends on 8) The method of claim 8, wherein the internal rib of the second cover member forms a contact seal only with the first portion of the image sensor. ### Claim 10 (depends on 1) The method of claim 1, wherein the permanent mount includes at least one solder pad, and the image sensor includes at least one solder ball; and wherein the at least one solder pad is electrically connected to the at least one solder ball. ### Claim 11 (depends on 1) The method of claim 1, wherein the image sensor has a width that is less than or equal to about one millimeter. ### Claim 12 An image sensor system, comprising: an image sensor comprising a lens structure, a silicon structure, and solder members; a permanent mount that is electrically coupled to the solder members; wherein the lens structure includes an uncoated top portion and a bottom portion that is coated with a dark coating agent wherein the silicon structure is configured to convert photons to charge carriers, and to produce image signals; and a sheath that covers at least the uncoated top portion. ### Claim 13 (depends on 12) The image sensor system of claim 12, wherein the image sensor has a width that is less than or equal to about one millimeter. ### Claim 14 A method of processing an image sensor system, comprising steps of: (a) placing a cover member on top of an image sensor, wherein the image sensor includes a first portion that is not coated with the dark coating agent, and a second portion that is coated with the dark coating agent; (b) affixing the image sensor on to a permanent mount to form an electrical coupling between the image sensor and the permanent mount; (c) removing the second cover member from the image sensor; wherein the cover member includes an internal rib configured to form a contact seal with the image sensor. ### Claim 15 (depends on 14) The method of claim 14, wherein the internal rib of the cover member forms a contact seal only with the first portion of the image sensor. ### Claim 16 (depends on 14) The method of claim 14, further comprising a step of placing a sheath over the image sensor, after step (c). ### Claim 17 (depends on 14) The method of claim 14, wherein the image sensor has a width that is less than or equal to about one millimeter. ### Claim 18 (depends on 14) The method of claim 14, wherein the permanent mount includes at least one solder pad, and the image sensor includes at least one solder ball; and wherein the at least one solder pad is electrically connected to the at least one solder ball.