# US 10,121,773 B2 · Semiconductor apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,773 B2 - Document ID: US10121773B2 - Status: Granted - Kind: B2 - Application number: 15/446,012 - Filed: 2017-03-01 - Published: 2017-06-22 - Granted: 2018-11-06 - Earliest claimed: 2015-03-05 - Assignees: Fuji Electric Co., Ltd. - Applicants: Fuji Electric Co., Ltd. - Inventors: Hideo Ami - Web page: https://patentgrep.com/patent/US10121773B2 ## CPC - H10W 90/00: Package configurations - H02M 3/158: including plural semiconductor devices as final control devices for a single load - H02M 7/48: using discharge tubes with control electrode or semiconductor devices with control electrode - H02M 7/487: Neutral point clamped inverters - H10W 42/80: protecting against overcurrent or overload, e.g. fuses or shunts (integrated devices comprising arrangements for electrical protection H10D89/60) - H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)} - H10W 70/611: {for connecting multiple chips together} - H10W 70/65: Shapes or dispositions of interconnections - H10W 72/926: {Multiple bond pads having different sizes} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) ## Abstract A semiconductor apparatus reduces the effect of inductances and induced magnetic fields, and causes a large current to flow from one device to another device. Provided is a semiconductor apparatus comprising a first device of a first region; a second device of a second region; and a connection conductor that electrically connects the first device to the second device. The connection conductor includes current paths that are adjacent and have opposite directions in at least a portion thereof. The connection conductor causes current to flow from the first device to the second device, and causes current to flow in a direction from the second device toward the first device in at least a portion thereof. ## Claims ### Claim 1 A semiconductor apparatus comprising: a plurality of first devices of a first region; one or more second devices of a second region; and a connection conductor that electrically connects the first devices to the second device, wherein the connection conductor includes current paths that are adjacent and have opposite directions in at least a portion thereof, and is connected in parallel to each of the plurality of first devices, and the connection conductor includes: a first current path with a direction away from the second device on a first device side: a second current path that folds back from the first current path to have a direction toward the second device; a third current path with a direction away from the first devices on a second device side; and a fourth current path that folds back from the third current path to have a direction toward the first devices. ### Claim 2 (depends on 1) The semiconductor apparatus according to claim 1, wherein the connection conductor causes current to flow from the first devices to the second device, and causes current to flow in a direction from the second device toward the first devices in at least a portion thereof. ### Claim 3 (depends on 1) The semiconductor apparatus according to claim 1, wherein the connection conductor causes current to flow from the second device to the first devices, and causes current to flow in a direction from the first devices to the second device in at least a portion thereof. ### Claim 4 (depends on 1) The semiconductor apparatus according to claim 1, wherein the connection conductor has a parallel board structure formed by the current paths that are adjacent to each other. ### Claim 5 (depends on 1) The semiconductor apparatus according to claim 1, comprising: a plurality of the second devices in the second region, wherein the connection conductor is connected in parallel with each of the plurality of second devices. ### Claim 6 (depends on 1) The semiconductor apparatus according to claim 1, wherein the connection conductor includes: a main conducting portion having the first current path, the second current path, the third current path, and the fourth current path; a plurality of first connecting portions that connect the first current path respectively to the plurality of first devices; and a plurality of second connecting portions that connect the third current path respectively to the plurality of second devices. ### Claim 7 (depends on 1) The semiconductor apparatus according to claim 1, comprising: a plurality of the first devices in the first region; and a plurality of the second devices in the second region, wherein the plurality of first devices and the plurality of second devices are arranged in a direction from the first region toward the second region. ### Claim 8 (depends on 1) The semiconductor apparatus according to claim 1, further comprising: a substrate, wherein the first region and the second region are provided in the substrate. ### Claim 9 (depends on 8) The semiconductor apparatus according to claim 8, wherein the substrate is an insulated substrate. ### Claim 10 (depends on 1) The semiconductor apparatus according to claim 1, wherein the first devices and the second device are insulated gate bipolar transistors or power MOSFETs. ### Claim 11 (depends on 1) The semiconductor apparatus according to claim 1, wherein the first current path is not directly electrically connected to the third current path and is connected to the third current path via the second current path and the fourth current path. ### Claim 12 (depends on 1) The semiconductor apparatus according to claim 1, wherein the connection conductor further includes a terminal portion that is connected to outside and transfers current to and from the outside. ### Claim 13 (depends on 12) The semiconductor apparatus according to claim 12, wherein an emitter terminal of one of the first devices is connected to a collector terminal of the second device via the connection conductor, and the emitter terminal of the first device and the collector terminal of the second device are connected to an external load via the terminal portion. ### Claim 14 (depends on 12) The semiconductor apparatus according to claim 12, wherein the terminal portion functions as an input terminal or an output terminal to transfer current between the outside of the semiconductor apparatus and the first device or between the outside of the semiconductor apparatus and the second device.