Target integrated circuit combined with a plurality of photovoltaic cells

A method for manufacturing a microchip structure, comprising:

• forming a plurality of photovoltaic (PV) diodes on a first surface of a transparent substrate, each of the plurality of PV diodes having an anode coupled to a respective anode contact and a cathode coupled to a respective cathode contact, wherein the transparent substrate is transparent to an electromagnetic (EM) frequency to which the plurality of PV diodes are sensitive, wherein each of the plurality of PV diodes includes a surface for receiving light to convert to electricity, wherein the surface of each of the plurality of PV diodes faces the transparent substrate such that the light for conversion to electricity can only be received at the plurality of PV diodes after passing through the transparent substrate;
• bonding at least the cathode contact of a first PV diode of the plurality of PV diodes to a first power contact located at a first location on a first surface of a target integrated circuit (TIC);
• and
• bonding at least the anode contact of a second PV diode of the plurality of PV diodes to a second power contact located at a second location on the first surface of the TIC.