# US 10,121,769 B2 · Fan-out semiconductor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,769 B2 - Document ID: US10121769B2 - Status: Granted - Kind: B2 - Application number: 15/437,766 - Filed: 2017-02-21 - Published: 2018-03-15 - Granted: 2018-11-06 - Earliest claimed: 2016-09-12 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics, Co., Ltd. - Inventors: Dae Hyun Park; Eun Jung Jo; Sung Won Jeong; Han Kim; Mi Ja Han - Web page: https://patentgrep.com/patent/US10121769B2 ## CPC - H01L 25/0657 - H01L 23/3157 - H01L 24/02 - H01L 24/09 - H01L 24/49 - H01L 2224/02372 - H01L 2224/02373 - H01L 2224/02379 - H01L 2225/0651 - H01L 2225/06548 - H01L 2225/06582 - H01L ## Abstract A fan-out semiconductor package includes: a first interconnection member having a through-hole; a first semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a first encapsulant encapsulating at least portions of the first interconnection member and the first semiconductor chip; a second interconnection member disposed on the first interconnection member and the first semiconductor chip; a second semiconductor chip disposed on the first encapsulant and having an active surface having connection pads disposed thereon; and a second encapsulant encapsulating at least portions of the second semiconductor chip. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the first semiconductor chip, and the connection pads of the second semiconductor chip are electrically connected to the redistribution layer of the first interconnection member by wires. ## Claims ### Claim 1 A fan-out semiconductor package comprising: a first interconnection member having a through-hole; a first semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; a first encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the first semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the first semiconductor chip; a second semiconductor chip disposed on the first encapsulant and having an active surface having connection pads disposed thereon; and a second encapsulant encapsulating at least portions of the second semiconductor chip, wherein the first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the first semiconductor chip, and the connection pads of the second semiconductor chip are electrically connected to the redistribution layer of the first interconnection member by wires. ### Claim 2 (depends on 1) The fan-out semiconductor package of claim 1, wherein the redistribution layer of the first interconnection member includes wire pads that the wires are connected to and wiring patterns redistributing the connection pads of the second semiconductor chip. ### Claim 3 (depends on 2) The fan-out semiconductor package of claim 2, wherein the first encapsulant has openings exposing at least portions of the wire pads of the redistribution layer of the first interconnection member. ### Claim 4 (depends on 1) The fan-out semiconductor package of claim 1, wherein the first semiconductor chip includes a processor chip, and the second semiconductor chip includes a memory chip. ### Claim 5 (depends on 1) The fan-out semiconductor package of claim 1, wherein the first interconnection member includes a first insulating layer, a first redistribution layer contacting the second interconnection member and embedded in a first surface of the first insulating layer, and a second redistribution layer disposed on a second surface of the first insulating layer opposing the first surface of the first insulating layer. ### Claim 6 A fan-out semiconductor package comprising: a first interconnection member having a through-hole; a first semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; a first encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the first semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the first semiconductor chip; a second semiconductor chip disposed on the first encapsulant and having an active surface having connection pads disposed thereon; and a second encapsulant encapsulating at least portions of the second semiconductor chip, wherein the first interconnection member includes a first insulating layer, a first redistribution layer contacting the second interconnection member and embedded in a first surface of the first insulating layer, a second redistribution layer disposed on a second surface of the first insulating layer opposing the first surface of the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the second redistribution layer, and a third redistribution layer disposed on the second insulating layer, the first to third redistribution layers of the first interconnection member are electrically connected to the connection pads of the first semiconductor chip, the second interconnection member includes a redistribution layer electrically connected to the connection pads of the first semiconductor chip, the connection pads of the second semiconductor chip are electrically connected to the third redistribution layer of the first interconnection member. ### Claim 7 A fan-out semiconductor package comprising: a first interconnection member having a through-hole; a first semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; a first encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the first semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the first semiconductor chip; a second semiconductor chip disposed on the first encapsulant and having an active surface having connection pads disposed thereon; and a second encapsulant encapsulating at least portions of the second semiconductor chip, wherein the first interconnection member includes a first insulating layer, a first redistribution layer contacting the second interconnection member and embedded in a first surface of the first insulating layer, and a second redistribution layer disposed on a second surface of the first insulating layer opposing the first surface of the first insulating layer, the first and second redistribution layers of the first interconnection member are electrically connected to the connection pads of the first semiconductor chip, the second interconnection member includes a redistribution layer electrically connected to the connection pads of the first semiconductor chip, a distance between the redistribution layer of the second interconnection member and the first redistribution layer is greater than that between the redistribution layer of the second interconnection member and the connection pad of the first semiconductor chip, and the connection pads of the second semiconductor chip are electrically connected to the second redistribution layer of the first interconnection member. ### Claim 8 A fan-out semiconductor package comprising: a first interconnection member having a through-hole; a first semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; a first encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the first semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the first semiconductor chip; a second semiconductor chip disposed on the first encapsulant and having an active surface having connection pads disposed thereon; and a second encapsulant encapsulating at least portions of the second semiconductor chip, wherein the first interconnection member includes a first insulating layer, a first redistribution layer contacting the second interconnection member and embedded in a first surface of the first insulating layer, and a second redistribution layer disposed on a second surface of the first insulating layer opposing the first surface of the first insulating layer, the first and second redistribution layers of the first interconnection member are electrically connected to the connection pads of the first semiconductor chip, the second interconnection member includes a redistribution layer electrically connected to the connection pads of the first semiconductor chip, the first redistribution layer has a thickness greater than that of the redistribution layer of the second interconnection member, and the connection pads of the second semiconductor chip are electrically connected to the second redistribution layer of the first interconnection member. ### Claim 9 (depends on 6) The fan-out semiconductor package of claim 6, wherein the second redistribution layer is disposed on a level between the active surface and the inactive surface of the first semiconductor chip. ### Claim 10 A fan-out semiconductor package comprising: a first interconnection member having a through-hole; a first semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; a first encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the first semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the first semiconductor chip; a second semiconductor chip disposed on the first encapsulant and having an active surface having connection pads disposed thereon; and a second encapsulant encapsulating at least portions of the second semiconductor chip, wherein the first interconnection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on both surfaces of the first insulating layer, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer, the first to third redistribution layers of the first interconnection member are electrically connected to the connection pads of the first semiconductor chip, the second interconnection member include a redistribution layer electrically connected to the connection pads of the first semiconductor chip, and the connection pads of the second semiconductor chip are electrically connected to the third redistribution layer of the first interconnection member. ### Claim 11 (depends on 10) The fan-out semiconductor package of claim 10, wherein the first interconnection member further includes a third insulating layer disposed on the first insulating layer and covering the second redistribution layer and a fourth redistribution layer disposed on the third insulating layer. ### Claim 12 (depends on 10) The fan-out semiconductor package of claim 10, wherein the first insulating layer has a thickness greater than that of the second insulating layer. ### Claim 13 (depends on 10) The fan-out semiconductor package of claim 10, wherein the third redistribution layer has a thickness greater than that of the redistribution layer of the second interconnection member. ### Claim 14 (depends on 10) The fan-out semiconductor package of claim 10, wherein the first redistribution layer is disposed on a level between the active surface and the inactive surface of the first semiconductor chip. ### Claim 15 (depends on 1) The fan-out semiconductor package of claim 1, wherein the redistribution layer of the first interconnection member includes wire pads connected to the wires and wiring patterns redistributing the connection pads of the second semiconductor chip.