# US 10,121,757 B2 · Pillar structure and manufacturing method thereof

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- Number: US 10,121,757 B2
- Document ID: US10121757B2
- Status: Granted
- Kind: B2
- Application number: 14/953,020
- Filed: 2015-11-27
- Published: 2017-04-20
- Granted: 2018-11-06
- Earliest claimed: 2015-10-19
- Assignees: Unimicron Technology Corp.
- Applicants: Unimicron Technology Corp.
- Inventors: Cheng-Jui Chang
- Web page: https://patentgrep.com/patent/US10121757B2

## CPC

- H05K 1/00: Printed circuits
- H05K 3/4015: {using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres}
- H10W 72/90: Bond pads, in general
- H05K 2201/10287: Metal wires as connectors or conductors
- H10W 72/01225: {in solid form, e.g. by using a powder or by stud bumping}
- H10W 72/01515: {Forming coatings}
- H10W 72/075: {of bond wires}
- H10W 72/221: {Structures or relative sizes}
- H10W 72/235: {of outermost layers of multilayered bumps, e.g. bump coating not being conformal on a bump core}
- H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/245: {of outermost layers of multilayered bumps, e.g. bump coating being only on a part of a bump core}
- H10W 72/255: {of outermost layers of multilayered bumps, e.g. material of a coating}
- H10W 72/521: {Structures or relative sizes of bond wires}
- H10W 72/541: {Dispositions of bond wires}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A pillar structure is disposed on a substrate. The pillar structure includes a pad, a metal wire bump, a metal wire, and a metal plating layer. The pad is disposed on the substrate. The metal wire bump is disposed on the pad. The metal wire is connected to the metal wire bump. The metal wire extends in a first extension direction, the substrate extends in a second extension direction, and the first extension direction is perpendicular to the second extension direction. The metal plating layer covers the pad and completely encapsulates the metal wire bump and the metal wire.

## Claims

### Claim 1

A pillar structure disposed on a substrate and comprising:
a pad disposed on the substrate;
a metal wire bump disposed on the pad;
a metal wire connected to the metal wire bump, the metal wire and the metal wire bump being integrally formed, wherein the metal wire extends in a first extension direction having a consistent diameter, the substrate extends in a second extension direction, and the first extension direction is perpendicular to the second extension direction, wherein a diameter of the metal wire is less than a width of the metal wire bump; and
a metal plating layer covering the pad and completely encapsulating the metal wire bump and the metal wire, wherein a length of the metal wire is ⅘ a length of the metal plating layer, and the metal plating layer covers an upper surface of the pad and encapsulates a side surface of the pad connecting the upper surface.

### Claim 2 (depends on 1)

The pillar structure as recited in claim 1, wherein an orthogonal projection of the metal wire bump on the substrate and an orthogonal projection of the pad on the substrate are completely overlapped, and an area of the orthogonal projection of the metal wire bump on the substrate is smaller than an area of the orthogonal projection of the pad on the substrate.

### Claim 3 (depends on 1)

The pillar structure as recited in claim 1, wherein a diameter of the metal wire is within a range from 15 micrometers to 200 micrometers.

### Claim 4

A manufacturing method of a pillar structure, comprising:
forming a pad on a substrate;
performing a wire bonding process to form a metal wire bump and a metal wire on the pad, wherein the metal wire bump is located on the pad, the metal wire is connected to the metal wire bump and extends in a first extension direction having a consistent diameter, the metal wire and the metal wire bump are integrally formed, the substrate extends in a second extension direction, and the first extension direction of the metal wire is perpendicular to the second extension direction of the substrate, wherein a diameter of the metal wire is less than a width of the metal wire bump; and
performing a plating process to form a metal plating layer with use of the pad, the metal wire bump, and the metal wire as an plating seed layer, so as to cover the pad and completely encapsulate the metal wire bump and the metal wire, wherein a length of the metal wire is ⅘ a length of the metal plating layer, and the metal plating layer covers an upper surface of the pad and encapsulates a side surface of the pad connecting the upper surface.

### Claim 5 (depends on 4)

The manufacturing method of the pillar structure as recited in claim 4, wherein an orthogonal projection of the metal wire bump on the substrate and an orthogonal projection of the pad on the substrate are completely overlapped, and an area of the orthogonal projection of the metal wire bump on the substrate is smaller than an area of the orthogonal projection of the pad on the substrate.

### Claim 6 (depends on 4)

The manufacturing method of the pillar structure as recited in claim 4, wherein a diameter of the metal wire is within a range from 15 micrometers to 200 micrometers.