# US 10,121,756 B2 · Anisotropic conductive film and connection structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,756 B2 - Document ID: US10121756B2 - Status: Granted - Kind: B2 - Application number: 15/316,649 - Filed: 2015-05-08 - Published: 2017-06-08 - Granted: 2018-11-06 - Earliest claimed: 2014-06-30 - Assignees: Dexerials Corporation - Applicants: Dexerials Corporation - Inventors: Seiichiro Shinohara; Yasushi Akutsu - Web page: https://patentgrep.com/patent/US10121756B2 ## CPC - H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads} - C09J 7/10: without carriers - C09J 9/02: Electrically-conducting adhesives - H01B 1/22: the conductive material comprising metals or alloys - C08K 2201/001: Conductive additives - C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors - C09J 2301/314: the adhesive layer and/or the carrier being conductive - C09J 2301/408: additives as essential feature of the adhesive layer - H10W 72/073: {of die-attach connectors} - H10W 72/07321: {Aligning} - H10W 72/07331: {Connecting techniques} - H10W 72/07332: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting} - H10W 72/07339: {hardening the adhesive by cooling, e.g. thermoplastics} - H10W 72/074: {of anisotropic conductive adhesives} - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/351: {Materials of die-attach connectors} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/354: {comprising polymers} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In order to easily inspect a dispersion state of conductive particles in such an anisotropic conductive film that the conductive particles are dispersed even at high density, linear lines including no conductive particle in a plan view of an anisotropic conductive film including an insulating adhesive layer and conductive particles dispersed in the insulating adhesive layer are allowed to exist at predetermined intervals. Specifically, the conductive particles are disposed in a lattice so as to be arranged in a first arrangement direction and a second arrangement direction, and the disappearance lines are inclined relative to the first arrangement direction or the second arrangement direction. ## Claims ### Claim 1 An anisotropic conductive film comprising an insulating adhesive layer and conductive particles dispersed in the insulating adhesive layer, wherein linear lines including no conductive particle in a plan view (hereinafter referred to as disappearance lines) exist at predetermined intervals, the conductive particles are disposed in a lattice so as to be arranged in a first arrangement direction and a second arrangement direction, and the disappearance lines are formed by an absence of conductive particles at lattice points within the lattice on lines that are (i) inclined relative to the first arrangement direction or the second arrangement direction or (ii) on lines parallel with the first arrangement direction or the second arrangement direction. ### Claim 2 (depends on 1) The anisotropic conductive film according to claim 1, wherein the anisotropic conductive film is formed in a band shape, and the disappearance lines are formed obliquely to a longitudinal direction of the anisotropic conductive film. ### Claim 3 (depends on 2) The anisotropic conductive film according to claim 2, wherein an angle formed by the longitudinal direction of the anisotropic conductive film and the disappearance line is smaller than an angle formed by a width direction of the anisotropic conductive film and the disappearance line. ### Claim 4 (depends on 1) The anisotropic conductive film according to claim 1, wherein the first arrangement direction of the conductive particles is parallel to the longitudinal direction of the anisotropic conductive film. ### Claim 5 (depends on 1) The anisotropic conductive film according to claim 1, wherein the first arrangement direction and the second arrangement direction of the conductive particles are orthogonal to each other. ### Claim 6 (depends on 1) The anisotropic conductive film according to claim 1, wherein the first arrangement direction and the second arrangement direction of the conductive particles intersect each other obliquely. ### Claim 7 (depends on 1) The anisotropic conductive film according to claim 1, wherein a density of the conductive particles is 100 to 100,000 particles/mm2. ### Claim 8 (depends on 1) A connection method for connecting a connecting terminal of a first electronic component to a connecting terminal of a second electronic component using the anisotropic conductive film according to claim 1 by anisotropic conductive connection, the connection method comprising matching a direction substantially orthogonal to the first arrangement direction or the second arrangement direction of the anisotropic conductive film to a longitudinal direction of the connecting terminal of the first electronic component or the second electronic component. ### Claim 9 (depends on 8) The connection method according to claim 8, wherein a connection surface of the connecting terminal has a size with a width of 8 to 200 μm and a length of 1,500 μm or less. ### Claim 10 (depends on 1) A connection structure in which a connecting terminal of a first electronic component and a connecting terminal of a second electronic component are connected by anisotropic conductive connection using the anisotropic conductive film according to claim 1. ### Claim 11 (depends on 1) The anisotropic conductive film according to claim 1, wherein an arrangement pitch in the first arrangement direction and an arrangement pitch in the second arrangement direction of the conductive particles arranged in the lattice are 0.5 to 128 times a particle diameter of the conductive particles. ### Claim 12 (depends on 1) A method of manufacturing a connection structure, comprising connecting a connecting terminal of a first electronic component and a connecting terminal of a second electronic component by anisotropic conductive connection using the anisotropic conductive film according to claim 1. ### Claim 13 An anisotropic conductive film comprising an insulating adhesive layer and conductive particles dispersed in the insulating adhesive layer, wherein the conductive particles are distanced from each other to be disposed randomly in a plan view, except the conductive particles are not included in linear regions located obliquely relative to a longitudinal direction of the film so as to form disappearance lines including no conductive particles, wherein the disappearance lines are spaced apart from each other at regularly spaced predetermined intervals. ### Claim 14 (depends on 13) A connection structure in which a connecting terminal of a first electronic component and a connecting terminal of a second electronic component are connected by anisotropic conductive connection using the anisotropic conductive film according to claim 13. ### Claim 15 (depends on 13) A method of manufacturing a connection structure, comprising connecting a connecting terminal of a first electronic component and a connecting terminal of a second electronic component by anisotropic conductive connection using the anisotropic conductive film according to claim 13.