# US 10,121,753 B2 · Enhanced solder pad > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,753 B2 - Document ID: US10121753B2 - Status: Granted - Kind: B2 - Application number: 15/642,810 - Filed: 2017-07-06 - Published: 2018-01-11 - Granted: 2018-11-06 - Earliest claimed: 2016-07-06 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Jens Oetjen; Stefan Macheiner - Web page: https://patentgrep.com/patent/US10121753B2 ## CPC - H10W 70/04: of leadframes - H10W 70/457: {of metallic layers on leadframes} - H10W 70/467: {Multilayered additional interconnections} - H10W 72/01935: {by plating, e.g. electroless plating or electroplating} - H10W 72/01938: {in gaseous form, e.g. by CVD or PVD} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 72/90: Bond pads, in general - H10W 72/923: {Bond pads having multiple stacked layers} - H10W 72/9415: {relative to the surface, e.g. recessed, protruding} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A solder pad includes a surface. A tin layer is arranged on the surface. At least one out of a bismuth layer, an antimony layer and a nickel layer is arranged on the tin layer. ## Claims ### Claim 1 A solder pad, comprising: a surface; a tin layer arranged on the surface; and three layers: a bismuth layer and an antimony layer and a nickel layer, which are arranged on the tin layer, wherein a first of the three layers is arranged on the tin layer, a second of the three layers is arranged on the first layer and the third of the three layers is arranged on the second layer, wherein each layer covers essentially the entire respective underlying layer. ### Claim 2 (depends on 1) The solder pad of claim 1, wherein a thickness of the tin layer lies in a range from about 5 micrometer to about 15 micrometer. ### Claim 3 (depends on 1) The solder pad of claim 1, wherein a thickness of the bismuth layer lies in a range from about 2 micrometer to about 10 micrometer. ### Claim 4 (depends on 1) The solder pad of claim 1, wherein a thickness of the antimony layer lies in a range from about 1 micrometer to about 6 micrometer. ### Claim 5 (depends on 1) The solder pad of claim 1, wherein a thickness of the nickel layer lies in a range from about 0.1 micrometer to about 0.6 micrometer. ### Claim 6 (depends on 1) The solder pad of claim 1, wherein the tin layer, the bismuth layer, the antimony layer and the nickel layer form a layer stack, and wherein a plurality of such layer stacks are formed on each other on the solder pad surface. ### Claim 7 (depends on 6) The solder pad of claim 6, wherein a total thickness of all tin layer thicknesses in the plurality of layer stacks lies in a range from about 5 micrometer to about 15 micrometer, a total thickness of all bismuth layer thicknesses in the plurality of layer stacks lies in a range from about 2 micrometer to about 10 micrometer, a total thickness of all antimony layer thicknesses in the plurality of layer stacks lies in a range from about 1 micrometer to about 6 micrometer, and a total thickness of all nickel layer thicknesses in the plurality of layer stacks lies in a range from about 0.1 micrometer to about 0.6 micrometer. ### Claim 8 (depends on 7) The solder pad of claim 7, wherein all layers made of a same material are of about the same thickness. ### Claim 9 (depends on 1) An electronic component, comprising the solder pad of claim 1. ### Claim 10 (depends on 1) The solder pad of claim 1, wherein the solder pad comprises copper. ### Claim 11 (depends on 1) The solder pad of claim 1, wherein the solder pad comprises aluminum. ### Claim 12 (depends on 1) The solder pad of claim 1, wherein the solder pad comprises a copper alloy. ### Claim 13 (depends on 1) The solder pad of claim 1, wherein the solder pad comprises an alloy 42. ### Claim 14 (depends on 1) The solder pad of claim 1, wherein the solder pad comprises a steel alloy. ### Claim 15 (depends on 1) The solder pad of claim 1, wherein the solder pad comprises an aluminum alloy. ### Claim 16 (depends on 1) The solder pad of claim 1, wherein the solder pad is plated with a metal layer. ### Claim 17 (depends on 16) The solder pad of claim 16, wherein the metal layer comprises silver. ### Claim 18 A solder pad, comprising: a surface; a tin layer arranged on the surface; and three layers: a bismuth layer and an antimony layer and a nickel layer, which are arranged on the tin layer, wherein the tin layer, the bismuth layer, the antimony layer and the nickel layer form a layer stack, and wherein a plurality of such layer stacks are formed on each other on the solder pad surface. ### Claim 19 (depends on 1) A method for enhancing a solder pad surface of the solder pad of claim 1, the method comprising: providing a solder pad comprising at least one solder pad surface; plating or sputtering tin onto the at least one solder pad surface to form a first tin layer; plating or sputtering a first of three materials bismuth, antimony, nickel onto the first tin layer to form a first material layer; plating or sputtering a second of the three materials onto the first material layer to form a second material layer; and plating or sputtering the third of the three materials onto the second material layer to form a third material layer. ### Claim 20 (depends on 19) The method of claim 19, further comprising: plating or sputtering tin onto the third material layer to form a second tin layer; plating or sputtering a first of three materials bismuth, antimony, nickel onto the second tin layer to form a fourth material layer; plating or sputtering a second of the three materials onto the fourth material layer to form a fifth material layer; and plating or sputtering the third of the three materials onto the fifth material layer to form a sixth material layer.