# US 10,121,735 B2 · Method of designing a layout of a semiconductor device, and a semiconductor device including a fin > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,735 B2 - Document ID: US10121735B2 - Status: Granted - Kind: B2 - Application number: 15/794,131 - Filed: 2017-10-26 - Published: 2018-06-21 - Granted: 2018-11-06 - Earliest claimed: 2016-12-15 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Seon-Ah Nam; Ikuo Nakamatsu; Dong-Hyun Kim; Chul-Hong Park; Yun-Se Oh; Hae-Wang Lee; Ho-Jun Choi - Web page: https://patentgrep.com/patent/US10121735B2 ## CPC - H10W 70/635: {Through-vias} - H10D 30/0243: {using dummy structures having essentially the same shapes as the semiconductor bodies, e.g. to provide stability} - H10D 30/62: Fin field-effect transistors [FinFET] - H10D 30/6212: {having fin-shaped semiconductor bodies having non-rectangular cross-sections} - H10D 84/834: {comprising FinFETs} - H10W 72/00: Interconnections or connectors in packages - H10D 84/0135: {Manufacturing their gate conductors} - H10D 84/0149: {Manufacturing their interconnections or electrodes, e.g. source or drain electrodes} - H10D 84/038: {using silicon technology, e.g. SiGe} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract A semiconductor device includes active fins on a substrate. Gate lines each extend in the second direction on the active fins. A contact plug is positioned on the active fins. A first via is in one of the first contact plugs. A first conductive line overlaps a first via. A first distance from a first active fin on which a first gate line of the gate lines is formed to an end of the first gate line is more than a predetermined distance. A second distance from a second active fin on which the first gate line is formed to the first active fin of the active fins is equal to or less than the predetermined distance. The second active fin is spaced apart from the first contact plugs to not overlap the first contact plugs. ## Claims ### Claim 1 A semiconductor device comprising: active fins each extending in a first direction, wherein the active fins are arranged along a second direction crossing the first direction on a substrate; gate lines each extending in the second direction, wherein the gate lines are arranged along the first direction on the active fins; first contact plugs, wherein at least one of the first contact plugs is positioned on a respective one of the active fins; first vias, wherein each of the first vias is formed in a respective one of the first contact plugs; and first conductive lines, wherein at least one of the first conductive lines overlaps a respective one of the first vias along a third direction orthogonal to the first and second directions, wherein a first distance from a first active fin of the active fins which a first gate line of the gate lines is formed to an end of the first gate line is equal to or greater than a predetermined distance, wherein a second distance from a second active fin of the active fins on which the first gate line is formed to the first active fin of the active fins is less than the predetermined distance, and wherein the second active fin is spaced apart from the first contact plugs to not overlap the first contact plugs along the third direction orthogonal to the first and second directions. ### Claim 2 (depends on 1) The semiconductor device of claim 1, further comprising second contact plugs, wherein at least one of the second contact plugs is positioned on a respective one of the gate lines, and wherein the second contact plugs are spaced apart from a portion of the first gate line from the first active fin to the end of the first gate line. ### Claim 3 (depends on 2) The semiconductor device of claim 2, further comprising: second vias, wherein each of the second vias is formed in a respective one of the second contact plugs; and second conductive lines, wherein at least one of the second conductive lines overlaps a respective one of the second vias along the third direction orthogonal to the first and second directions. ### Claim 4 (depends on 1) The semiconductor device of claim 1, wherein the first and second directions are substantially perpendicular to each other, and wherein each of the first conductive lines extends in the first direction. ### Claim 5 (depends on 1) The semiconductor device of claim 1, further comprising a source/drain layer between the active fins and the first contact plugs. ### Claim 6 (depends on 5) The semiconductor device of claim 5, wherein the source/drain layer commonly contacts a plurality of third active fins of the active fins. ### Claim 7 A semiconductor device comprising: active fins each extending in a first direction, wherein the active fins are arranged along a second direction crossing the first direction on a substrate; gate lines each extending in the second direction, wherein the gate lines are arranged along the first direction on the active fins; first contact plugs, wherein at least one of the first contact plugs is positioned on a respective one of the active fins; first vias, wherein each of the first vias is formed in a respective one of the first contact plugs; and first conductive lines, wherein at least one of the first conductive lines overlaps a respective one of the first vias along a third direction orthogonal to the first and second directions, wherein a first distance between two first active fins of the active fins on which a first gate line of the gate lines is formed is at least as long as a predetermined distance, and a second distance from a second active fin of the active fins on which the first gate line is formed to each of the first active fins is less than the predetermined distance, wherein the second active fin is positioned between the two first active fins along the second direction, and wherein the second active fin is spaced apart from the first contact plugs to not overlap the first contact plugs along the third direction orthogonal to the first and second directions. ### Claim 8 (depends on 7) The semiconductor device of claim 7, further comprising second contact plugs, wherein at least one of the second contact plugs is positioned on a respective one of the gate lines, and wherein the second contact plugs are not formed on a portion of the first gate line between the two first active fins. ### Claim 9 (depends on 8) The semiconductor device of claim 8, further comprising: second vias, wherein each of the second vias is formed in a respective one of the second contact plugs; and second conductive lines, wherein at least one of the second conductive lines overlaps a respective one of the second vias along the third direction orthogonal to the first and second directions. ### Claim 10 (depends on 7) The semiconductor device of claim 7, wherein the first and second directions are substantially perpendicular to each other, and wherein each of the first conductive lines extends in the first direction. ### Claim 11 (depends on 7) The semiconductor device of claim 7, further comprising a source/drain layer between the active fins and the first contact plugs. ### Claim 12 (depends on 11) The semiconductor device of claim 11, wherein the source/drain layer commonly contacts a plurality of third active fins of the active fins. ### Claim 13 A semiconductor device comprising: a plurality of active fins extending in a first direction, wherein the plurality of active fins includes a first active fin, a second active fin and a third active fin sequentially arranged along a second direction crossing the first direction; a plurality of conductive lines extending in the first direction; a plurality of gate lines extending in the second direction, wherein a first gate line of the plurality of gate lines crosses the first, second and third active fins, wherein a first portion of the first gate line extending from the first active fin across the second and third active fins is at least as long as a predetermined distance, and wherein a distance between the second and third active fins is less than the predetermined distance; and a plurality of contact plugs including a via formed in each of the contact plugs, wherein a first contact plug of the plurality of contact plugs is formed on a conductive line of the plurality of conductive lines and a second portion of the first gate line on an opposite side of the first active fin from the first portion of the first gate line. ### Claim 14 (depends on 13) The semiconductor device of claim 13, wherein the first direction is perpendicular to the second direction. ### Claim 15 (depends on 14) The semiconductor device of claim 14, wherein the first active fin is configured to receive an electrical signal at the second portion of the at least one gate line. ### Claim 16 (depends on 15) The semiconductor device of claim 15, wherein a second gate line of the plurality of gate lines extending in the second direction is spaced apart from the second and third active fins along the first direction, and wherein a second contact plug is formed on the second gate line. ### Claim 17 (depends on 16) The semiconductor device of claim 16, wherein the second gate line crosses a fourth active fin extending in the first direction and spaced apart from the first gate line in the first direction. ### Claim 18 (depends on 17) The semiconductor device of claim 17, wherein the fourth active fin is positioned between the second and third active fins along the second direction.