# US 10,121,726 B2 · Cooler for semiconductor devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,726 B2 - Document ID: US10121726B2 - Status: Granted - Kind: B2 - Application number: 14/839,510 - Filed: 2015-08-28 - Published: 2017-03-02 - Granted: 2018-11-06 - Earliest claimed: 2015-08-28 - Assignees: Intel IP Corporation - Applicants: Intel IP Corporation - Inventors: Sven Albers; Klaus Reingruber; Andreas Wolter; Georg Seidemann; Christian Geissler; Alexandra Atzesdorfer; Sonja Koller - Web page: https://patentgrep.com/patent/US10121726B2 ## CPC - H10W 40/251: {Organics} - G06F 1/203: {for portable computers, e.g. for laptops} - H10W 40/25: characterised by their materials - H10W 40/73: for cooling by change of state - G06F 2200/201: Cooling arrangements using cooling fluid - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract Embodiments of the present disclosure relate to a cooler for semiconductor devices. The semiconductor device may be electrically coupleable to a power source. The device may generate heat when the power source supplies power to the device during use of the device. The cooler may be coupled to one or more surfaces of the device. The cooler may include a hydrophilic material to adsorb water from ambient air. During operation of the device, the cooler may cool the device by conduction of heat away from the device to the cooler. The cooler may include water that is evaporated during use of the device to increase cooling capacity of the cooler. The cooler may be recharged with water from humidity in air when the device is not operated or operated at a lower power level. Other embodiments may be described and/or claimed. ## Claims ### Claim 1 A semiconductor device, comprising: a semiconductor device with a surface, wherein the device is to generate heat when a power source supplies power to the device during use of the device; and a cooler coupled to the surface of the device, wherein the cooler includes: a hydrophilic material disposed on the surface of the semiconductor device, to absorb water vapor from ambient air; a solution formed on top of the hydrophilic material, in response to a dissolution of at least a portion of the hydrophilic material with the water vapor; and a semipermeable membrane disposed above the solution to enclose the hydrophilic material and form an open space between the membrane and the hydrophilic material, wherein the semipermeable membrane prevents liquid water from passing through the semipermeable membrane and allows the water vapor to pass through the semipermeable membrane. ### Claim 2 (depends on 1) The semiconductor device of claim 1, wherein the hydrophilic material is in direct contact with the surface of the device. ### Claim 3 (depends on 1) The semiconductor device of claim 1, wherein the semipermeable membrane is coupled to the surface of the device on a perimeter of the semipermeable membrane, wherein the hydrophilic material is in direct contact with the surface of the device. ### Claim 4 (depends on 1) The semiconductor device of claim 1, wherein the semipermeable membrane is a closed pouch that is coupled to the surface of the device and the hydrophilic material is encased inside the closed pouch. ### Claim 5 (depends on 1) The semiconductor device of claim 1, wherein the semipermeable membrane includes a polymer material that includes one or more of polytetrafluoroethylene, polyurethane, polyamide, aromatic polyamide, polyethersulfone, or polysulfone. ### Claim 6 (depends on 3) The semiconductor device of claim 3, wherein the semipermeable membrane is coupled to the surface by a glue. ### Claim 7 (depends on 6) The semiconductor device of claim 6, wherein the glue includes metal particles. ### Claim 8 (depends on 1) The semiconductor device of claim 1, wherein the hydrophilic material includes an inorganic salt or a solution of an inorganic salt. ### Claim 9 (depends on 8) The semiconductor device of claim 8, wherein the inorganic salt includes sodium chloride, calcium chloride, magnesium chloride, or calcium oxide. ### Claim 10 (depends on 1) The semiconductor device of claim 1, wherein the hydrophilic material includes polyacrylic acid, hyaluronic acid, silica gel, silane, or urea. ### Claim 11 (depends on 1) The semiconductor device of claim 1, wherein the hydrophilic material includes a hydrophilic polymer. ### Claim 12 (depends on 11) The semiconductor device of claim 11, wherein the hydrophilic polymer includes hydroxyl, carboxyl, amine, or ionic groups. ### Claim 13 (depends on 11) The semiconductor device of claim 11, wherein the hydrophilic polymer includes a hydrogel. ### Claim 14 (depends on 11) The semiconductor device of claim 11, wherein the hydrophilic polymer includes poly(N-isopropylacrylamide), polyacrylamide, poly(2-oxazoline), polyethylenimine, poly(acrylic acid), polymethacrylate, acrylic polymer, poly(ethylene glycol), poly(ethylene oxide), poly(vinyl alcohol) (PVA), copolymers of PVA, poly(vinylpyrrolidone), copolymers of PVP, polyelectrolytes, or cucurbit[n]uril hydrate. ### Claim 15 (depends on 1) The semiconductor device of claim 1, wherein the device is a die, a package, or a printed circuit board. ### Claim 16 (depends on 1) The semiconductor device of claim 1, wherein the cooler is coupled directly to a die of the semiconductor device. ### Claim 17 (depends on 16) The semiconductor device of claim 16, wherein the die is a processor. ### Claim 18 A system, comprising: a circuit board; and a semiconductor package with a front side coupled to the circuit board, the semiconductor package including: a back side surface opposite the front side; and a cooler coupled to the back side surface of the package, wherein the cooler includes a hydrophilic material disposed on the surface of the semiconductor package, to adsorb water vapor from ambient air; a solution formed on top of the hydrophilic material in response to a dissolution of at least a portion of the hydrophilic material with the water vapor; and a semipermeable membrane disposed above the solution to enclose the hydrophilic material and form an open space between the membrane and the hydrophilic material wherein the semipermeable membrane prevents liquid water from passing through the semipermeable membrane and allows the water vapor to pass through the semipermeable membrane, wherein the semiconductor package is to generate heat when a power source supplies power to the semiconductor package during use of the semiconductor package. ### Claim 19 (depends on 18) The system of claim 18, wherein the hydrophilic material is in direct contact with the surface of the package. ### Claim 20 (depends on 18) The system of claim 18, wherein the semipermeable membrane is coupled to the surface of the package on a perimeter of the semipermeable membrane, wherein the hydrophilic material is in direct contact with the surface of the package. ### Claim 21 (depends on 18) The system of claim 18, wherein the semipermeable membrane is a closed pouch that is coupled to the surface of the package and the hydrophilic material is encased inside the closed pouch. ### Claim 22 (depends on 20) The system of claim 20, wherein the semipermeable membrane includes a polymer material that includes one or more of polytetrafluoroethylene, polyurethane, polyamide, aromatic polyamide, polyethersulfone, or polysulfone. ### Claim 23 (depends on 20) The system of claim 20, wherein the semipermeable membrane is coupled to the surface by a glue.