# US 10,121,725 B2 · Systems for thermal management and methods for the use thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,725 B2 - Document ID: US10121725B2 - Status: Granted - Kind: B2 - Application number: 15/811,185 - Filed: 2017-11-13 - Published: 2018-03-08 - Granted: 2018-11-06 - Earliest claimed: 2015-05-29 - Assignees: Henkel IP & Holding GmbH - Applicants: Henkel IP & Holding GmbH - Inventors: Yuan Zhao; Mulugeta Berhe; Daniel Maslyk; Scott Timon Allen - Web page: https://patentgrep.com/patent/US10121725B2 ## CPC - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - B32B 3/26: characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids {(foam layer B32B5/18; layer of synthetic resin characterised by fillers that create voids or cavities B32B27/205); characterised by an apertured layer} - B32B 5/18: characterised by features of a layer {of} foamed material - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 9/007: {comprising carbon, e.g. graphite, composite carbon} - B32B 15/02: {Layer formed of wires, e.g. mesh} - B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} - B32B 25/08: of synthetic resin - B32B 25/14: comprising {synthetic rubber copolymers (B32B25/18 and B32B25/20 take precedence)} - B32B 37/12: characterised by using adhesives - C09K 5/063: {Materials absorbing or liberating heat during crystallisation; Heat storage materials} - H10P 14/68: Organic materials, e.g. photoresists - H10W 40/251: {Organics} - H10W 40/257: {having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence)} - H10W 40/73: for cooling by change of state - H10W 40/735: {by melting or evaporation of solids} - B32B 38/08: Impregnating - B32B 2260/02: Composition of the impregnated, bonded or embedded layer - B32B 2266/045: Metal - B32B 2305/022: Foam - B32B 2307/302: Conductive - B32B 2307/732: Dimensional properties - B32B 2309/105: Thickness - B32B 2311/00: Metals, their alloys or their compounds - B32B 2457/00: Electrical equipment - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract In accordance with the present invention, there are provided heat dispersing articles, assemblies containing same, methods for the preparation thereof, and various uses therefor. In one aspect of the present invention, there are provided heat dispersing articles. In another aspect of the present invention, there are provided methods for producing the above-referenced articles. In yet another aspect of the present invention, there are provided assemblies containing the above-referenced articles. In still another aspect of the present invention, there are provided methods for making the above-referenced assemblies. In yet another aspect, there are provided methods to dissipate the heat generated by portable electronic devices. ## Claims ### Claim 1 A heat-dispersing article comprising: a first conductive/protective layer, one or more porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM) so as to substantially cover the surface and voids of said porous thermally conductive, low-profile structure, wherein said formulated PCM comprises said PCM containing 5-20% by weight of a gelling agent mixed with said PCM, and a second conductive/protective layer, wherein said one or more porous thermally conductive, low-profile structure(s) are sandwiched between said first and second conductive/protective layers, and wherein said article has: a latency of at least 100 J/cc, and an effective thermal conductivity of at least 10 W/mK. ### Claim 2 (depends on 1) The article of claim 1 wherein said porous thermally conductive, low-profile structure comprises a copper mesh, a copper cloth, a copper foam, an aluminum mesh, an aluminum cloth, or an aluminum foam. ### Claim 3 (depends on 2) The article of claim 2 wherein the porous thermally conductive, low-profile structure is a wire mesh. ### Claim 4 (depends on 2) The article of claim 2, wherein the thickness of the porous thermally conductive, low-profile structure falls in the range of about 50 μm up to about 1 mm. ### Claim 5 (depends on 2) The article of claim 2 wherein the thickness of the formulated PCM is 1-2 times the thickness of the porous thermally conductive, low-profile structure. ### Claim 6 (depends on 1) The article of claim 1 wherein said porous thermally conductive, low-profile structure has an area opening ratio in the range of about 40% up to about 70%, and a volumetric opening ratio in the range of about 60% up to about 95%. ### Claim 7 (depends on 1) The article of claim 1 wherein said formulated PCM is prepared by mixing 5%-20% by weight of a gelling agent with a phase change material selected from: a paraffin (CnH2n+2), wherein n falls in the range of about 20 up to 40, or a fatty acid (CH3(CH2)2nCOOH) with similar melting temperature range, or mixtures of any two or more thereof. ### Claim 8 (depends on 7) The article of claim 7 wherein said formulated PCM is substantially uniformly gelled throughout the thickness of said porous thermally conductive, low-profile structure(s). ### Claim 9 (depends on 1) The article of claim 1 wherein said PCM is encapsulated. ### Claim 10 (depends on 9) The article of claim 9 wherein: said porous thermally conductive, low-profile structure is impregnated with said formulated PCM, and then said impregnated porous thermally conductive, low-profile structure is laminated with a heat conducting sheet through a pressure sensitive adhesive (PSA) layer, which prevents the PCM from leaking out. ### Claim 11 (depends on 10) The article of claim 10 wherein said heat conducting sheet is a copper foil, a copper mesh, a copper cloth, a copper foam, an aluminum foil, an aluminum mesh, an aluminum cloth, an aluminum foam, or a graphite sheet. ### Claim 12 (depends on 11) The article of claim 11 wherein said heat conducting sheet has a thickness in the range of 25 μm to 500 μm. ### Claim 13 (depends on 11) The article of claim 11 wherein said heat conducting sheet is a graphite sheet having a thickness in the range of 25 μm to 70 μm. ### Claim 14 A heat-dispersing assembly comprising: 5 μm to 20 μm thickness of a first pressure sensitive adhesive layer, a conductive base layer having a thickness in the range of about 17 μm to 500 μm; 25 μm to 150 μm of a porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM), 5 μm to 10 μm thickness of a second pressure sensitive adhesive layer, 25 μm to 50 μm thickness of a thermal conductive/protective layer, and 5 μm to 10 μm thickness of an electrical insulation layer. ### Claim 15 A heat-dispersing assembly comprising: 5 μm to 20 μm thickness of a first pressure sensitive adhesive layer, a conductive base layer having a thickness in the range of about 17 μm to 500 μm; 25 μm to 150 μm of a first porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM), 5 μm to 10 μm thickness of a second pressure sensitive adhesive layer, 25 μm to 150 μm of a second porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM), 25 μm to 50 μm thickness of a thermal conductive/protective layer, and 5 μm to 10 μm thickness of an electrical insulation layer. ### Claim 16 A heat-dispersing assembly comprising: 5 μm to 20 μm thickness of a first pressure sensitive adhesive layer, a conductive base layer having a thickness in the range of about 17 μm to 500 μm; 25 μm to 150 μm of a first porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM), 5 μm to 10 μm thickness of a second pressure sensitive adhesive layer, 25 μm to 150 μm of a second porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM), 5 μm to 10 μm thickness of a third pressure sensitive adhesive layer, 25 μm to 150 μm of a third porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM), 25 μm to 50 μm thickness of a thermal conductive/protective layer, and 5 μm to 10 μm thickness of an electrical insulation layer. ### Claim 17 (depends on 1) A method to prepare an article according to claim 1, said method comprising impregnating a porous thermally conductive, low-profile structure with a sufficient quantity of a molten form of a formulated phase change material (PCM) so as to substantially wet the porous thermally conductive, low-profile structure. ### Claim 18 (depends on 17) The method of claim 17 wherein said formulated phase change material comprises said PCM containing 5-20% by weight of a gelling agent mixed with said PCM.