# US 10,121,714 B2 · Semiconductor device and casing of the semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,714 B2 - Document ID: US10121714B2 - Status: Granted - Kind: B2 - Application number: 15/606,816 - Filed: 2017-05-26 - Published: 2018-01-18 - Granted: 2018-11-06 - Earliest claimed: 2016-07-15 - Assignees: Fuji Electric Co., Ltd. - Applicants: Fuji Electric Co., Ltd. - Inventors: Kousuke Komatsu - Web page: https://patentgrep.com/patent/US10121714B2 ## CPC - H10W 76/15: Containers comprising an insulating or insulated base - H01R 12/7082: {Coupling device supported only by cooperation with PCB} - H01R 12/73: connecting to other rigid printed circuits or like structures - H01R 13/2492: {multiple contact points} - H05K 3/325: by abutting or pinching; Mechanical auxiliary parts therefor - H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] - H10W 70/20: Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40) - H10W 70/415: {Leadframe inner leads serving as die pads} - H10W 70/68: Shapes or dispositions thereof - H10W 70/69: Insulating materials thereof - H10W 72/00: Interconnections or connectors in packages - H10W 76/18: Insulating materials, e.g. resins, glasses or ceramics - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K 2201/10189: Non-printed connector - H05K 2201/10265: Metallic coils or springs, e.g. as part of a connection element - H05K 2201/10325: Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support - H05K 2201/10409: Screws - H10W 72/07231: {Techniques} - H10W 72/234: {Cross-sectional shape, i.e. in side view} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A semiconductor device includes a box-shaped casing including a ceiling wall with a first window, a semiconductor chip having an output electrode and assembled in the casing, a first conductive block disposed in the casing, and a first connection terminal being bent so as to implement an elongated U-shape. The semiconductor device is adapted for electrical connection to a circuit board having a first land. The circuit board is placed on the ceiling wall. The first window is at a position corresponding to the first land. A lower end of the first conductive block is connected to a surface of the output electrode and the first connection terminal contacts to the first conductive block. ## Claims ### Claim 1 A semiconductor device for electrical connection to a circuit board having a first land, comprising: a box-shaped casing including a ceiling wall, on which the circuit board is placed, the ceiling wall being provided with a first window at a position corresponding to the first land; a semiconductor chip assembled in the casing, the semiconductor chip having an output electrode; a first conductive block disposed in the casing, a lower end of the first conductive block being connected to a surface of the output electrode; a first connection terminal being bent so as to implement an elongated U-shape in a cross-sectional view, configured to provide a pair of opposite surfaces in the U-shape, the first connection terminal being scheduled to be connected to the first land through an upper end implemented by a bottom of the U-shape via the first window, both sides of an upper part of the first conductive block being interposed between the opposite surfaces at a lower end implemented by a top of the U-shape, the first connection terminal contacting to the first conductive block through the opposite surfaces; and a pair of supporting side-walls fixed to the casing, the supporting side-walls covering the first connection terminal except the upper end in the casing, wherein the supporting side-walls establish a narrow constriction at a position higher than a contact site between the first connection terminal and the first conductive block, the narrow constriction defines a smallest width between the pair of supporting side-walls, and at the narrow constriction, the supporting side-walls contact to the first connection terminal from both sides of the first connection terminal so that the first conductive block presses against inner walls of the first connection terminal. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein a swelling portion is provided in the U-shape, a width measured at the same height position between outer surfaces of the swelling portion is larger than a width of the narrow constriction. ### Claim 3 (depends on 1) The semiconductor device according to claim 1, wherein two or more contact protrusions, which project toward the first land, are provided at an upper end of the first connection terminal, side by side along the width direction. ### Claim 4 (depends on 1) The semiconductor device according to claim 1, wherein the first connection terminal is a single plate bent into the U-shape. ### Claim 5 (depends on 1) The semiconductor device according to claim 1, wherein the first conductive block has: a base portion having a bottom surface extending along a surface of the output electrode; and a projecting portion protruding from the base portion toward the first connection terminal, wherein the bottom surface is bonded to the surface of the output electrode, and both sides of the projecting portion are interposed between the opposite surfaces so that the projecting portion contacts to the opposite surfaces. ### Claim 6 (depends on 1) The semiconductor device according to claim 1, further comprising an insulating substrate configured to mount the semiconductor chip, wherein a bottom opening of the casing is closed by the insulating substrate. ### Claim 7 (depends on 1) The semiconductor device according to claim 1, further comprising: a second conductive block disposed in the casing; and a second connection terminal being bent so as to implement an elongated second U-shape in a cross-sectional view, configured to provide a pair of second opposite surfaces in the second U-shape, wherein the circuit board has a second land, the semiconductor chip has an open-emitter electrode, the casing of the semiconductor device has a second window provided at a position corresponding to the second land of the ceiling wall, a lower end of the second conductive block is connected to a surface of the open-emitter electrode, the second connection terminal is scheduled to be connected to the second land through an upper end implemented by a bottom of the second U-shape via the second window, and both sides of an upper part of the second conductive block are interposed between the second opposite surfaces at a lower end implemented by a top of the U-shape and the second connection terminal contacts to the second conductive block through the second opposite surfaces. ### Claim 8 (depends on 1) The semiconductor device according to claim 1, wherein the semiconductor chip is a reverse-conducting insulated-gate bipolar transistor. ### Claim 9 A casing of a semiconductor device for electrically connecting the semiconductor device to a circuit board having a land, comprising: a box-shaped outer wall including a ceiling wall on which the circuit board is placed, the ceiling wall being provided with a window at a position corresponding to the land; a connection terminal being bent so as to implement an elongated U-shape in a cross-sectional view, configured to provide a pair of opposite surfaces in the U-shape, the connection terminal being scheduled to be connected to the land through an upper end implemented by a bottom of the U-shape via the window, the connection terminal being adapted for connecting to a semiconductor chip, which is scheduled to be mounted in the outer wall through the opposite surfaces at a lower end implemented by a top of the U-shape; and a pair of supporting side-walls fixed to the outer wall, the supporting side-walls facing each other, the supporting side-walls covering the connection terminal except the upper end in the outer wall, the supporting side-walls establishing a narrow constriction, which defines a smallest width between the pair of supporting side-walls, and the supporting side-walls supporting the connection terminal through the narrow constriction. ### Claim 10 A semiconductor device for electrical connection to a circuit board having a first land, comprising: a box-shaped casing including a ceiling wall, on which the circuit board is placed, the ceiling wall being provided with a first window at a position corresponding to the first land; a semiconductor chip assembled in the casing, the semiconductor chip having an output electrode; a first conductive block disposed in the casing, a lower end of the first conductive block being connected to a surface of the output electrode; and a first connection terminal being bent so as to implement an elongated U-shape in a cross-sectional view, configured to provide a pair of opposite surfaces in the U-shape, the first connection terminal being scheduled to be connected to the first land through an upper end implemented by a bottom of the U-shape via the first window, both sides of an upper part of the first conductive block being interposed between the opposite surfaces at a lower end implemented by a top of the U-shape, the first connection terminal contacting to the first conductive block through the opposite surfaces, wherein two or more contact protrusions, which project toward the first land, are provided at an upper end of the first connection terminal, side by side along the width direction.