# US 10,121,696 B2 · Electronic device package and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,696 B2 - Document ID: US10121696B2 - Status: Granted - Kind: B2 - Application number: 15/298,251 - Filed: 2016-10-20 - Published: 2017-08-17 - Granted: 2018-11-06 - Earliest claimed: 2016-02-16 - Assignees: Winbond Electronics Corp. - Applicants: Winbond Electronics Corp. - Inventors: Yu-Hsuan Ho - Web page: https://patentgrep.com/patent/US10121696B2 ## CPC - H10W 20/031: {of conductive parts of the interconnections} - H10W 70/658: {for devices provided for in groups H10D8/00 - H10D48/00} - H10W 70/688: {Flexible insulating substrates} - H10W 70/692: Ceramics or glasses - H10W 70/695: Organic materials - H10W 74/01: Manufacture or treatment - H10W 74/114: {by a substrate and the encapsulations} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic device package and a manufacturing method thereof are provided. The electronic device package includes a flexible substrate, a first wiring structure, a first electronic device and a thermoplastic film having a second wiring structure. The first wiring structure is disposed on the flexible substrate. The first electronic device is disposed on the flexible substrate. The first electronic device and the first wiring structure are separated from each other. The thermoplastic film is welded to the flexible substrate and seals the first electronic device. The second wiring structure electrically connects the first wiring structure to the first electronic device. The electronic device package can be manufactured with a production cost. ## Claims ### Claim 1 An electronic device package, comprising: a flexible substrate; a first wiring structure, disposed on the flexible substrate; a first electronic device, disposed on the flexible substrate, wherein the first electronic device and the first wiring structure are separated from each other; and a thermoplastic film having a second wiring structure, welded to the flexible substrate and sealing the first electronic device, wherein the second wiring structure directly connects the first wiring structure and the first electronic device, and the thermoplastic film partially covers the first wiring structure. ### Claim 2 (depends on 1) The electronic device package of claim 1, wherein the first electronic device comprises an integrated circuit chip. ### Claim 3 (depends on 1) The electronic device package of claim 1, wherein the first wiring structure and the first electronic device are protruded from a surface of the flexible substrate or recessed in the flexible substrate. ### Claim 4 (depends on 1) The electronic device package of claim 1, wherein the thermoplastic film further has a second electronic device electrically connected to the second wiring structure. ### Claim 5 (depends on 4) The electronic device package of claim 4, wherein the second electronic device comprises a radio frequency identification device or a thin film transistor. ### Claim 6 A manufacturing method of an electronic device package, comprising: forming a first wiring structure on a flexible substrate; placing a first electronic device on the flexible substrate, wherein the first electronic device and the first wiring structure are separated from each other; and welding a thermoplastic film having a second wiring structure to the flexible substrate, wherein the thermoplastic film seals the first electronic device, the second wiring structure directly connects the first wiring structure and the first electronic device, and the thermoplastic film partially covers the first wiring structure. ### Claim 7 (depends on 6) The manufacturing method of claim 6, wherein a method of forming the first wiring structure comprises performing a printing. ### Claim 8 (depends on 6) The manufacturing method of claim 6, further comprising, before the step of welding the thermoplastic film to the flexible substrate, performing a first heating process and a first pressing process in a process chamber, such that the first wiring structure and the first electronic device are recessed in the flexible substrate, and a top surface of the first wiring structure, a top surface of the first electronic device and a surface of the flexible substrate form a planar surface. ### Claim 9 (depends on 6) The manufacturing method of claim 6, further comprising, before the step of welding the thermoplastic film to the flexible substrate, placing the thermoplastic film on the flexible substrate, wherein the second wiring structure is aligned to the first wiring structure and the first electronic device. ### Claim 10 (depends on 6) The manufacturing method of claim 6, wherein a method of forming the second wiring structure comprises performing a printing. ### Claim 11 (depends on 10) The manufacturing method of claim 10, wherein the printing comprises a roll-to-roll printing. ### Claim 12 (depends on 6) The manufacturing method of claim 6, wherein the thermoplastic film further has a second electronic device electrically connected to the second wiring structure. ### Claim 13 (depends on 6) The manufacturing method of claim 6, wherein a method of welding the thermoplastic film to the flexible substrate comprises performing a second heating process to the thermoplastic film. ### Claim 14 (depends on 13) The manufacturing method of claim 13, wherein the method of welding the thermoplastic film to the flexible substrate comprises: performing the second heating process and a second pressing process in a process chamber, so as to melt the thermoplastic film. ### Claim 15 (depends on 14) The manufacturing method of claim 14, wherein the method of welding the thermoplastic film to the flexible substrate further comprises: cooling the thermoplastic film in the process chamber at a pressure of the second pressing process. ### Claim 16 (depends on 13) The manufacturing method of claim 13, wherein the method of welding the thermoplastic film to the flexible substrate comprises: performing the second heating process in a process chamber at a first pressure, so as to melt the thermoplastic film; and cooling the thermoplastic film in the process chamber at a second pressure, wherein the second pressure is greater than the first pressure.