# US 10,121,688 B2 · Electrostatic chuck with external flow adjustments for improved temperature distribution > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,688 B2 - Document ID: US10121688B2 - Status: Granted - Kind: B2 - Application number: 15/481,183 - Filed: 2017-04-06 - Published: 2017-07-27 - Granted: 2018-11-06 - Earliest claimed: 2013-12-31 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Matthew J. Busche; Vijay D. Parkhe; Wendell Boyd, Jr.; Senh Thach; Konstantin Makhratchev; Masanori Ono - Web page: https://patentgrep.com/patent/US10121688B2 ## CPC - H10P 72/722: {Details of electrostatic chucks} - H05K 7/20218: {using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)} - H10P 72/0432: {mainly by conduction} - H10P 72/0434: {mainly by convection} - H10P 72/72: using electrostatic chucks - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, a method for adjusting coolant flow in an electrostatic chuck includes heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer. Heat is detected at a plurality of locations on a top surface of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck. A plurality of valves are adjusted to control coolant flow into the coolant chambers based on the detected heat. ## Claims ### Claim 1 A method for adjusting coolant flow in an electrostatic chuck, the method comprising: heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer; detecting heat at a plurality of locations on a top surf ace of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck; and adjusting a plurality of valves to control coolant flow into the coolant chambers based on the detected heat, wherein the plurality of valves is embedded within the electrostatic chuck. ### Claim 2 (depends on 1) The method of claim 1, wherein detecting heat comprises imaging the dielectric puck during flowing coolant into the coolant chambers through the valves and during applying heat to the dielectric puck. ### Claim 3 (depends on 2) The method of claim 2, wherein applying heat comprises activating heaters within the electrostatic chuck. ### Claim 4 (depends on 1) The method of claim 1 wherein adjusting a plurality of valves comprises independently rotating valve bodies of each of the plurality of valves to move the valve bodies with respect to a valve seat to control the flow of coolant from a supply plenum to a respective coolant chamber. ### Claim 5 (depends on 1) The method of claim 1, wherein detecting heat comprises determining a temperature level at different areas of the dielectric puck, the different areas corresponding to different coolant chambers. ### Claim 6 (depends on 5) The method of claim 5, wherein adjusting the plurality of valves comprises increasing coolant flow to coolant chambers corresponding to hotter areas and decreasing coolant flow to coolant chambers corresponding to cooler areas. ### Claim 7 (depends on 1) The method of claim 1, wherein adjusting valves comprises driving gear motors of a valve controller, the gear motors each being coupled to a respective one of the valves to individually control coolant flow into each respective coolant chamber. ### Claim 8 (depends on 1) The method of claim 1, wherein adjusting a plurality of valves comprises adjusting valves between a common supply plenum that receives coolant from an external source and each of the plurality of coolant chambers to control the flow rate of coolant from the supply plenum to the respective cooling zone. ### Claim 9 (depends on 1) The method of claim 1, wherein the coolant chambers are within a cooling plate fastened to and thermally coupled to the dielectric puck. ### Claim 10 (depends on 1) The method of claim 1, wherein adjusting a plurality of valves comprises activating a valve controller to engage and independently control each valve to adjust the flow of coolant through each valve by driving a gear motor to adjust the position of a valve body of each respective valve. ### Claim 11 (depends on 9) The method of claim 9, wherein controlling flow into the coolant chambers comprises controlling flow through a respective plurality of orifices each defined in a middle plate of the cooling plate into respective coolant chambers of the middle plate. ### Claim 12 (depends on 11) The method of claim 11, wherein the middle plate has hexagonal areas to define the coolant chambers. ### Claim 13 (depends on 12) The method of claim 12, wherein each hexagonal area is supplied by a different one of the plurality of valves. ### Claim 14 An apparatus for adjusting coolant flow in an electrostatic chuck, the apparatus comprising: means for heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer; means for detecting heat at a plurality of locations on a top surf ace of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck; and means for adjusting a plurality of valves to control coolant flow into the coolant chambers based on the detected heat, wherein the plurality of valves is embedded within the electrostatic chuck. ### Claim 15 (depends on 14) The apparatus of claim 14, wherein the means for detecting heat comprises an imager to image the dielectric puck during flowing coolant into the coolant chambers through the valves and during applying heat to the dielectric puck. ### Claim 16 (depends on 15) The apparatus of claim 15, wherein the means for heating comprises resistance heaters activated within the electrostatic chuck. ### Claim 17 (depends on 14) The apparatus of claim 14 wherein the means for adjusting a plurality of valves comprises independently rotatable valve bodies of each of the plurality of valves to move the valve bodies with respect to a valve seat to control the flow of coolant from a supply plenum to a respective coolant chamber. ### Claim 18 (depends on 14) The apparatus of claim 14, wherein the means for adjusting comprises a processor coupled to the means for detecting heat and to a valve controller to operate a motor of the valve controller to adjust coolant flow based on the detected heat. ### Claim 19 (depends on 14) The method of claim 14, wherein the means for detecting heat determines a temperature level at different areas of the dielectric puck, the different areas corresponding to different coolant chambers. ### Claim 20 (depends on 19) The method of claim 19, wherein the means for adjusting the plurality of valves operates by increasing coolant flow to coolant chambers corresponding to hotter areas and decreasing coolant flow to coolant chambers corresponding to cooler areas.