# US 10,121,684 B2 · Manufacturing method, pickup method, equipment and EMI (electromagnetic interference) electromagnetic shielding layer manufacturing method of SiP (system in package) module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,684 B2 - Document ID: US10121684B2 - Status: Granted - Kind: B2 - Application number: 15/247,959 - Filed: 2016-08-26 - Published: 2017-05-25 - Granted: 2018-11-06 - Earliest claimed: 2015-11-20 - Applicants: Universal Global Technology (Shanghai) Co., Ltd. - Inventors: Bin Wu; Tsung-Yu Li - Web page: https://patentgrep.com/patent/US10121684B2 ## CPC - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H05K 3/328: by welding - H05K 2203/081: Blowing of gas, e.g. for cooling or for providing heat during solder reflowing - H05K 2203/082: Suction, e.g. for holding solder balls or components - Y10T 29/49144: by metal fusion - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The invention discloses, pickup method, equipment and EMI electromagnetic shielding layer manufacturing method of SiP module. The method for picking up the SiP module comprises the following steps: A nozzle descends to touch the upper surface of the SiP module; the nozzle sucks the SiP module; an air thimble ascends to touch the lower surface of the carrier; the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble; compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened; the nozzle ascends and picks up the SiP module. ## Claims ### Claim 1 A method for picking up the SiP module which is fixed on the upper surface of a carrier by a doubled-sided adhesive tape, and comprises the following steps: a nozzle descends to touch the upper surface of the SiP module; the nozzle sucks the SiP module; an air thimble ascends to touch the lower surface of the carrier; the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble; compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened; the nozzle ascends and picks up the SIP module. ### Claim 2 (depends on 1) The method for picking up the SiP module according to claim 1, wherein, the pressure of the sprayed compressed air is higher than or equal to the bonding force of the doubled-sided adhesive tape. ### Claim 3 (depends on 2) The method for picking up the SiP module according to claim 2, further comprises the following steps: the air thimble descends to be separated from the lower surface of the carrier. ### Claim 4 (depends on 1) The method for picking up the SiP module according to claim 1, wherein, the pressure of the sprayed compressed air is smaller than the bonding force of the doubled-sided adhesive tape, so as to make the rest bonding force between the SiP module and the doubled-sided adhesive tape which is loosened is smaller than the suction force of the nozzle. ### Claim 5 (depends on 4) The method for picking up the SiP module according to claim 4, further comprises the following steps: the air thimble descends to be separated from the lower surface of the carrier. ### Claim 6 (depends on 1) The method for picking up the SiP module according to claim 1, further comprises the following steps: the air thimble descends to be separated from the lower surface of the carrier. ### Claim 7 A EMI electromagnetic shielding layer manufacturing method of the SiP module, and comprises the following steps: the SiP module is fixedly arranged on the upper surface of the carrier with the through hole through the doubled-sided adhesive tape, the lower surface of the SiP module is a surface, which is provided with the welding pads, and the welding pads are right above the through hole and do not touch the doubled-sided adhesive tape; conductive material is sputtered around and on the upper surface of the SIP module to form an EMI electromagnetic shielding layer; the nozzle descends to touch the upper surface of the SIP module, and sucks the SiP module; the air thimble ascends to touch the lower surface of the carrier; the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble; compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened; the nozzle ascends to pick up the manufactured SiP module with EMI electromagnetic shielding layers on the upper surface and around and without pollution or damage on the lower surface. ### Claim 8 (depends on 7) The EMI electromagnetic shielding layer manufacturing method of the SIP module according to claim 7, wherein, the pressure of the sprayed compressed air is higher than or equal to the bonding force of the doubled-sided adhesive tape. ### Claim 9 (depends on 7) The EMI electromagnetic shielding layer manufacturing method of the SiP module according to claim 7, wherein, the pressure of the sprayed compressed air is smaller than the bonding force of the doubled-sided adhesive tape, so as to make the rest bonding force between the SIP module and the doubled-sided adhesive tape which is loosened is smaller than the suction force of the nozzle. ### Claim 10 (depends on 9) The EMI electromagnetic shielding layer manufacturing method of the SiP module according to claim 9, further comprises the following steps: the air thimble descends to be separated from the lower surface of the carrier. ### Claim 11 (depends on 7) The EMI electromagnetic shielding layer manufacturing method of the SiP module according to claim 7, further comprises the following steps: the air thimble descends to be separated from the lower surface of the carrier. ### Claim 12 A manufacturing method of the SIP module, and the method comprises the following steps: chips, active components and passive components required for the SiP module are welded on the upper surface of a PCB (printed circuit board), welding pads are pre-reserved on the lower surface of the PCB, and the PCBA (printed circuit board assembly) of the SiP module is manufactured; molding compound is filled in the PCBA, so that the molding compound covers the chips, active components and passive components on the upper surface of the PCBA, the molding compound is solidified and the SiP module is manufactured; the SiP module is fixedly arranged on the upper surface of the carrier with the through hole through the doubled-sided adhesive tape, the lower surface of the SiP module is a surface, which is provided with the welding pads, and the welding pads are right above the through hole and do not touch the doubled-sided adhesive tape; conductive material is sputtered around and on the upper surface of the SiP module to form an EMI electromagnetic shielding layer; the nozzle descends to touch the upper surface of the SiP module, and sucks the SiP module; the air thimble ascends to touch the lower surface of the carrier; the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble; compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened; the nozzle ascends to pick up the manufactured SiP module without pollution or damage on the lower surface. ### Claim 13 (depends on 12) The manufacturing method of the SIP module according to claim 12, wherein, the pressure of the sprayed compressed air is higher than or equal to the bonding force of the doubled-sided adhesive tape. ### Claim 14 (depends on 13) The manufacturing method of the SiP module according to claim 13, further comprises the following step: the air thimble descends to be separated from the lower surface of the carrier. ### Claim 15 (depends on 12) The manufacturing method of the SiP module according to claim 12, wherein, the pressure of the sprayed compressed air is smaller than the bonding force of the doubled-sided adhesive tape, so as to make the rest bonding force between the SiP module and the doubled-sided adhesive tape which is loosened is smaller than the suction force of the nozzle. ### Claim 16 (depends on 15) The manufacturing method of the SiP module according to claim 15, further comprises the following step: the air thimble descends to be separated from the lower surface of the carrier. ### Claim 17 (depends on 12) The manufacturing method of the SiP module according to claim 12, further comprises the following step: the air thimble descends to be separated from the lower surface of the carrier. ### Claim 18 (depends on 12) The manufacturing method of the SiP module according to claim 12, wherein, the PCB, the PCBA and the SiP module which is manufactured through the solidification of molding compound are respectively a strip PCB, a strip PCBA and a strip SiP module; the strip SiP module is cut into single unit of SP module before conductive material sputtering.