# US 10,121,672 B2 · Cutting method for cutting processing-target object and cutting apparatus that cuts processing-target object > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,672 B2 - Document ID: US10121672B2 - Status: Granted - Kind: B2 - Application number: 15/621,165 - Filed: 2017-06-13 - Published: 2017-12-28 - Granted: 2018-11-06 - Earliest claimed: 2016-06-22 - Assignees: Disco Corporation - Applicants: Disco Corporation - Inventors: Koichi Shigematsu - Web page: https://patentgrep.com/patent/US10121672B2 ## CPC - H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices - B28D 5/022: {by cutting with discs or wheels} - H10D 84/038: {using silicon technology, e.g. SiGe} - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/0616: {Monitoring of warpages, curvatures, damages, defects or the like} - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - H10P 74/238: {comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement} - H10H 20/036: {of packages} - H10P 34/42: with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) - H10P 72/7416: {used during dicing or grinding} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B28D: WORKING STONE OR STONE-LIKE MATERIALS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract There is provided a cutting method for cutting a processing-target object by a cutting blade. The cutting method includes a holding step of holding the processing-target object by a holding table and a cutting step of cutting the processing-target object by the cutting blade by causing the cutting blade that rotates to cut into the processing-target object held by the holding table and causing the holding table and the cutting blade to relatively move after the holding step is carried out. In the cutting step, cutting is carried out with detection of whether or not a crack in the processing-target object exists by a crack detecting unit disposed on the rear side relative to the cutting blade in a cutting progression direction in which cutting processing of the processing-target object by the cutting blade progresses. ## Claims ### Claim 1 A cutting method for cutting a processing-target object by a cutting blade, the cutting method comprising: a holding step of holding the processing-target object by a holding table; and a cutting step of cutting the processing-target object by the cutting blade by causing the cutting blade that rotates to cut into the processing-target object held by the holding table and causing the holding table and the cutting blade to relatively move after the holding step is carried out, wherein: in the cutting step, cutting is carried out with detection of whether or not a crack in the processing-target object exists by a crack detecting unit disposed on a rear side relative to the cutting blade in a cutting progression direction in which cutting processing of the processing-target object by the cutting blade progresses, and the cutting blade and the crack detecting unit are both supported by a blade unit, and further wherein said blade unit, with the cutting blade and the crack detecting unit supported thereon, and the holding table are moved relative to each other in the cutting progression direction during the cutting step. ### Claim 2 (depends on 1) The cutting method according to claim 1, wherein: relative movement between the holding table and the cutting blade is stopped or speed of the relative movement is decreased when a crack in the processing-target object is detected by the crack detecting unit in execution of the cutting step. ### Claim 3 A cutting apparatus that cuts a processing-target object, the cutting apparatus comprising: a holding table that holds the processing-target object; cutting means having a cutting blade that cuts the processing-target object held by the holding table; moving means that causes the cutting blade and the holding table to relatively move; and a crack detecting unit that is disposed on a rear side relative to the cutting blade in a cutting progression direction in which cutting processing of the processing-target object by the cutting blade progresses, and detects whether or not a crack in the processing-target object exists, and wherein the cutting blade and the crack detecting unit are both supported by a blade unit, and further wherein said blade unit, with the cutting blade and the crack detecting unit supported thereon, and the holding table are moved relative to each other in the cutting progression direction during the cutting step. ### Claim 4 (depends on 1) The cutting method according to claim 1, wherein when a crack is detected by the crack detecting unit during execution of the cutting step, information related to the crack is transmitted to control equipment, whereby said control equipment decreases the cutting-feed rate or changes the rotational speed of the cutting blade. ### Claim 5 (depends on 3) The cutting apparatus according to claim 3, wherein when a crack is detected by the crack detecting unit during cutting processing, information related to the crack is transmitted to control equipment, whereby said control equipment decreases the cutting-feed rate or changes the rotational speed of the cutting blade. ### Claim 6 (depends on 1) The cutting method according to claim 1, wherein the blade unit is configured and arranged to be moved up and down in a Z-axis direction with respect to the holding table via a Z-axis movement mechanism. ### Claim 7 (depends on 3) The cutting apparatus according to claim 3, wherein the blade unit is configured and arranged to be moved up and down in a Z-axis direction with respect to the holding table via a Z-axis movement mechanism. ### Claim 8 (depends on 1) The cutting method according to claim 1, wherein when the crack detecting unit detects the generation of a crack, the position of the crack is recorded and device chips located near the position of the crack are considered as defective. ### Claim 9 (depends on 3) The cutting apparatus according to claim 3, wherein when the crack detecting unit detects the generation of a crack, the position of the crack is recorded and device chips located near the position of the crack are considered as defective. ### Claim 10 (depends on 1) The cutting method according to claim 1, wherein the crack detecting unit detects cracks by oscillating and observing ultrasonic waves. ### Claim 11 (depends on 3) The cutting apparatus according to claim 3, wherein the crack detecting unit detects cracks by oscillating and observing ultrasonic waves. ### Claim 12 (depends on 4) The cutting method according to claim 4, wherein said change in the rotational speed of the cutting blade comprises stopping the rotation of the cutting blade. ### Claim 13 (depends on 5) The cutting apparatus according to claim 5, wherein said change in the rotational speed of the cutting blade comprises stopping the rotation of the cutting blade.