# US 10,121,593 B2 · Composite electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,593 B2 - Document ID: US10121593B2 - Status: Granted - Kind: B2 - Application number: 15/176,564 - Filed: 2016-06-08 - Published: 2016-12-22 - Granted: 2018-11-06 - Earliest claimed: 2015-06-16 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Kazuo Hattori; Isamu Fujimoto; Shinichiro Kuroiwa - Web page: https://patentgrep.com/patent/US10121593B2 ## CPC - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01F 17/0013: {with stacked layers} - H01F 27/292: {Surface mounted devices} - H01G 2/06: specially adapted for mounting on a printed-circuit support - H01G 2/065: {for surface mounting, e.g. chip capacitors} - H01G 4/005: Electrodes - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) - H01G 4/40: Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract A composite electronic component includes a first and second electronic elements, and a joint material. The first electronic element includes a base member, and an upper surface conductor on an upper surface of the base member. The second electronic element includes an element body with a lower surface facing the upper surface of the base member, and a terminal conductor disposed on the lower surface of the element body. The joint material joins the upper surface conductor and the terminal conductor. The upper surface conductor includes a conductive layer in which a metal that is maximum in weight ratio is Ag. The lateral surface of the conductive layer is covered with conductive layers defining a protective metal film, and the metal that is maximum in weight ratio contained in the conductive layers defining a protective metal film is a metal other than Ag and Cu. ## Claims ### Claim 1 A composite electronic component comprising: a first electronic element; a second electronic element mounted on the first electronic element in a height direction; and a joint material joining the first electronic element and the second electronic element; wherein the first electronic element functions as a passive element and includes an insulating base member including an upper surface intersecting with the height direction, and an upper surface conductor disposed on the upper surface of the base member; the second electronic element includes an element body including a lower surface facing the upper surface of the base member in the height direction, and a terminal conductor disposed on at least a portion of the lower surface of the element body; the joint material joins at least a portion of the upper surface conductor and at least a portion of the terminal conductor; the upper surface conductor includes a conductive layer containing Ag or Cu as a metal component that is maximum in weight ratio; at least a portion of the lateral surface of the conductive layer is covered with a protective metal film; and the metal component that is maximum in weight ratio contained in the protective metal film is a metal other than Ag and Cu. ### Claim 2 (depends on 1) The composite electronic component according to claim 1, wherein the metal component that is maximum in weight ratio contained in the protective metal film is any one of Sn, Ni, Au and Pb. ### Claim 3 (depends on 1) The composite electronic component according to claim 1, wherein the protective metal film is a covering conductive layer that covers the upper surface and the lateral surfaces of the conductive layer contained in the upper surface conductor. ### Claim 4 (depends on 3) The composite electronic component according to claim 3, wherein the protective metal film is a plating layer. ### Claim 5 (depends on 1) The composite electronic component according to claim 1, wherein the protective metal film is part of the joint material. ### Claim 6 (depends on 1) The composite electronic component according to claim 1, wherein the upper surface conductor is smaller than the terminal conductor in any directions orthogonal to the height direction. ### Claim 7 (depends on 1) The composite electronic component according to claim 1, wherein a thickness of the upper surface conductor is greater than or equal to about 5 μm. ### Claim 8 (depends on 1) The composite electronic component according to claim 1, wherein the upper surface conductor includes a first upper surface conductor and a second upper surface conductor that are separated from each other in a length direction orthogonal to the height direction, and a third upper surface conductor located between the first upper surface conductor and the second upper surface conductor; the terminal conductor includes a first terminal conductor and a second terminal conductor that are separated from each other in the length direction; the first terminal conductor is joined with the first upper surface conductor by the joint material; and the second terminal conductor is joined with the second upper surface conductor by the joint material. ### Claim 9 (depends on 8) The composite electronic component according to claim 8, wherein the first upper surface conductor is located between each end of the first terminal conductor in a width direction orthogonal to the height direction and the length direction; the second upper surface conductor is located between each end of the second terminal conductor in the width direction; of the lateral surfaces of the first upper surface conductor, the lateral surface orthogonal to the width direction is covered with the protective metal film; and of the lateral surfaces of the second upper surface conductor, the lateral surface orthogonal to the width direction is covered with the protective metal film. ### Claim 10 (depends on 9) The composite electronic component according to claim 9, wherein a dimension in the width direction of the base member is larger than a dimension in the width direction of the second electronic element. ### Claim 11 (depends on 8) The composite electronic component according to claim 8, wherein the first upper surface conductor is located between an outer end of the first terminal conductor and an outer end of the second terminal conductor in the length direction; the second upper surface conductor is located between the outer end of the first terminal conductor and the outer end of the second terminal conductor in the length direction; of the lateral surfaces of the first upper surface conductor, the lateral surface orthogonal to the length direction is covered with the protective metal film; and of the lateral surfaces of the second upper surface conductor, the lateral surface orthogonal to the length direction is covered with the protective metal film. ### Claim 12 (depends on 11) The composite electronic component according to claim 11, wherein a dimension in the length direction of the base member is larger than a dimension in the length direction of the second electronic element. ### Claim 13 (depends on 8) The composite electronic component according to claim 8, wherein the element body includes a plurality of dielectric layers and a plurality of conductive layers that are laminated; and the first electronic element includes a resistor that is disposed on the upper surface of the base member and connected with the third upper surface conductor. ### Claim 14 (depends on 13) The composite electronic component according to claim 13, wherein the upper surface conductor includes a fourth upper surface conductor located between the first upper surface conductor and the second upper surface conductor; and the resistor is connected with the fourth upper surface conductor. ### Claim 15 (depends on 1) The composite electronic component according to claim 1, wherein the upper surface conductor includes a first upper surface conductor and a second upper surface conductor that are separated from each other in a length direction orthogonal to the height direction; the terminal conductor includes a first terminal conductor and a second terminal conductor that are separated from each other in the length direction; the first terminal conductor is joined with the first upper surface conductor by the joint material; the second terminal conductor is joined with the second upper surface conductor by the joint material; the first electronic element includes a lower surface conductor disposed on the lower surface thereof opposite to the upper surface of the base member; the lower surface conductor includes a first lower surface conductor and a second lower surface conductor that are separated from each other in the length direction, and a third lower surface conductor located between the first lower surface conductor and the second lower surface conductor; the element body includes a plurality of dielectric layers and a plurality of conductive layers that are laminated; and the first electronic element includes inductor wiring that is disposed inside the base member and is electrically connected with the third lower surface conductor. ### Claim 16 (depends on 15) The composite electronic component according to claim 15, wherein the lower surface conductor includes a fourth lower surface conductor located between the first lower surface conductor and the second lower surface conductor; and the inductor wiring is electrically connected with the fourth lower surface conductor.