Dielectric material with enhanced breakdown strength
Assignee3M Innovative Properties Company
InventorsNanayakkara L. D. Somasiri, Paul V. Huynh, Andrew C. Lottes, William L. Taylor, Levent Biyikli, Carl E. Fisher
Life of this patent
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Abstract
An enhanced breakdown strength dielectric material includes a base dielectric layer having first and second opposing major surfaces. A first stress mitigating layer is disposed on the first major surface of the base dielectric layer. A second stress mitigating layer disposed on the second major surface of the base dielectric layer. A volume conductivity of at least one of the first and second stress mitigating layers is at least 2 times a volume conductivity of the base dielectric layer.
Claims16
An enhanced breakdown strength dielectric material comprising:
- a base dielectric layer having first and second opposing major surfaces,
- a first stress mitigating layer disposed on the first major surface of the base dielectric layer, and
- a second stress mitigating layer disposed on the second major surface of the base dielectric layer,
- wherein a ratio of a volume conductivity of at least one of the first and second stress mitigating layers to a volume conductivity of the base dielectric layer is greater than or equal to 2, wherein each stress migrating layer comprises a molybdenum disulfide (MoS2) filler material having a concentration of about 0.8% to about 12% by volume based on the total volume of the stress migrating layer.
An enhanced breakdown strength dielectric material comprising:
- a base dielectric layer having first and second opposing major surfaces,
- a first stress mitigating layer disposed on the first major surface of the base dielectric layer, and
- a second stress mitigating layer disposed on the second major surface of the base dielectric layer,
- wherein a ratio of a volume conductivity of at least one of the first and second stress mitigating layers to a volume conductivity of the base dielectric layer is greater than or equal to 2, wherein each stress migrating layer comprises a tungsten disulfide (WS2) filler material having a concentration of about 0.5% to about 16% by volume based on the total volume of the stress migrating layer.
Dependencies are inferred from the claim text.