# US 10,121,052 B2 · Fingerprint identification device and electronic device using same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,052 B2 - Document ID: US10121052B2 - Status: Granted - Kind: B2 - Application number: 15/088,721 - Filed: 2016-04-01 - Published: 2017-06-15 - Granted: 2018-11-06 - Earliest claimed: 2015-12-14 - Assignees: Interface Technology (ChengDu) Co., Ltd.; Interface Optoelectronics (Shenzhen) Co., Ltd. - Applicants: MiiCs & Partners (Shenzhen) Co., Ltd. - Inventors: Juan Wang - Web page: https://patentgrep.com/patent/US10121052B2 ## CPC - G06V 40/1329: {Protecting the fingerprint sensor against damage caused by the finger} - G06F 21/32: using biometric data, e.g. fingerprints, iris scans or voiceprints - G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract A fingerprint identification device includes a cover, a light-shielding layer formed on the cover, an intermediate layer formed on the light-shielding layer, an adhesive layer formed on the intermediate layer, a protection layer formed on the adhesive layer, and a fingerprint identification element. The fingerprint identification element is configured to identify a fingerprint. The fingerprint identification element is embedded in the protection layer. ## Claims ### Claim 1 A fingerprint identification device comprising: a cover; a light-shielding layer formed on the cover; an adhesive layer formed on the light-shielding layer; an intermediate layer between the light-shielding layer and the adhesive layer; a protection layer formed on the adhesive layer; and a fingerprint identification element configured to identify a fingerprint, and the fingerprint identification element being embedded in the protection layer; wherein the intermediate layer is configured to dissolve in an organic solvent to separate the light-shielding layer from the adhesive layer when recycling the fingerprint identification device by dipping the fingerprint identification device in the organic solvent; the protection layer is configured to not dissolve in the organic solvent to protect the fingerprint identification element from being destroyed by the organic solvent when recycling the fingerprint identification device; wherein both the adhesive layer and the intermediate layer have rectangular shapes; the intermediate layer has a length of D1 and a width of W1; the adhesive layer has a length of D2 and a width of W2; D1 is at least 50 μm larger than D2, and W1 is at least 50 μm larger than W2. ### Claim 2 (depends on 1) The fingerprint identification device of claim 1, wherein the intermediate layer is made of a material mainly containing acrylic resin. ### Claim 3 (depends on 1) The fingerprint identification device of claim 1, wherein the protection layer is made of a material mainly containing an epoxide resin. ### Claim 4 (depends on 1) The fingerprint identification device of claim 1, wherein the intermediate layer has a thickness H1 in a range from 5 μm to 10 μm; the adhesive layer has a thickness H2 in a range from 2 μm to 10 μm. ### Claim 5 (depends on 4) The fingerprint identification device of claim 4, wherein a distance H3 from a surface of the protection layer adjacent to the adhesive layer to the fingerprint identification element is in a range from about 1 μm to about 10 μm. ### Claim 6 (depends on 5) The fingerprint identification device of claim 5, wherein a total of the thickness H1 of the intermediate layer, the thickness H2 of the adhesive layer, and the distance H3 is less than 20 μm. ### Claim 7 (depends on 5) The fingerprint identification device of claim 5, wherein a distance H4 from a surface of the protection layer parallel to direction of the thickness H2 to the fingerprint identification element is more than 5 μm. ### Claim 8 (depends on 1) The fingerprint identification device of claim 1, wherein the cover is made of transparent glass or transparent polymer. ### Claim 9 (depends on 1) The fingerprint identification device of claim 1, wherein the light-shielding layer is made of an ink mainly containing epoxy resin. ### Claim 10 (depends on 1) The fingerprint identification device of claim 1, wherein the adhesive layer is made of an adhesive mainly containing epoxy resin. ### Claim 11 (depends on 1) The fingerprint identification device of claim 1, wherein the fingerprint identification element comprises a signal receiving layer, a signal sending layer formed on the signal receiving layer, and a thin film transistor array located between the signal receiving layer and the signal sending layer; the signal sending layer is formed on a surface of the thin film transistor array adjacent to the adhesive layer. ### Claim 12 An electronic device comprising: a fingerprint identification device comprising: a cover; a light-shielding layer formed on the cover; an adhesive layer formed on the light-shielding layer; an intermediate layer between the light-shielding layer and the adhesive layer; a protection layer formed on the adhesive layer; and a fingerprint identification element configured to identify a fingerprint, and the fingerprint identification element being embedded in the protection layer; wherein the intermediate layer is configured to dissolve in an organic solvent to separate the light-shielding layer from the adhesive layer when recycling the fingerprint identification device by dipping the fingerprint identification device in the organic solvent; the intermediate layer is configured to not dissolve in the organic solvent to protect the fingerprint identification element from being destroyed by the organic solvent when recycling the fingerprint identification device; wherein both the adhesive layer and the intermediate layer have rectangular shapes; the intermediate layer has a length of D1 and a width of W1; the adhesive layer has a length of D2 and a width of W2; D1 is at least 50 μm larger than D2, and W1 is at least 50 μm larger than W2. ### Claim 13 (depends on 12) The electronic device of claim 12, wherein the intermediate layer is made of a material mainly containing acrylic resin. ### Claim 14 (depends on 12) The electronic device of claim 12, wherein the intermediate layer has a thickness H1 in a range from 5 μm to 10 μm; the adhesive layer has a thickness H2 in a range from 2 μm to 10 μm. ### Claim 15 (depends on 14) The electronic device of claim 14, wherein a distance H3 from a surface of the protection layer adjacent to the adhesive layer to the fingerprint identification element is in a range from about 1 μm to about 10 μm; a total of the thickness H1 of the intermediate layer, the thickness H2 of the adhesive layer, and the distance H3 is less than 20 μm; a distance H4 from a surface of the protection layer parallel to direction of the thickness H2 to the fingerprint identification element is more than 5 μm. ### Claim 16 (depends on 12) The electronic device of claim 12, wherein the cover is made of transparent glass or transparent polymer; the light-shielding layer is made of an ink mainly containing epoxy resin; the adhesive layer is made of an adhesive mainly containing epoxy resin; the protection layer is made of a material mainly containing an epoxide resin, and the protection layer is insoluble in an organic solvent.