# US 10,120,500 B2 · Electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,120,500 B2 - Document ID: US10120500B2 - Status: Granted - Kind: B2 - Application number: 15/658,953 - Filed: 2017-07-25 - Published: 2018-02-01 - Granted: 2018-11-06 - Earliest claimed: 2016-07-29 - Assignees: Japan Display Inc. - Applicants: Japan Display Inc. - Inventors: Yoshikatsu Imazeki - Web page: https://patentgrep.com/patent/US10120500B2 ## CPC - G06F 3/0416: {Control or interface arrangements specially adapted for digitisers} - G06F 3/044: by capacitive means - H01L 21/486 - H01L 23/3192 - H01L 23/49827 - H01L 23/49833 - H01L 23/5226 - G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices - G06F 2203/04108: Touchless 2D- digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface without distance measurement in the Z direction - G06F 2203/04111: Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate - G06F 2203/04112: Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H01L ## Abstract In one embodiment, an electronic device includes first and second substrates, an insulating layer, and a connecting material. The first substrate includes a first conductive layer. The second substrate includes a basement having first and second surfaces, a second conductive layer on the second surface, and a first hole penetrating through the basement. The insulating layer is arranged between the first conductive layer and the basement, and has a second hole. The connecting material connects conductive layers via holes. The first hole has a first opening on a first surface side. The second hole has a third opening on a first conductive layer side which is larger than the first opening. ## Claims ### Claim 1 An electronic device comprising: a first substrate which includes a first conductive layer; a second substrate which includes a basement which has a first surface opposed to the first conductive layer and separated from the first conductive layer, and a second surface opposite to the first surface, a second conductive layer which is arranged on the second surface, and a first hole which penetrates through between the first surface and the second surface; an insulating layer which is arranged between the first conductive layer and the basement, and has a second hole which is connected to the first hole; and a connecting material which electrically connects the first conductive layer and the second conductive layer via the first hole and the second hole, wherein the first hole has a first opening on a first surface side and a second opening on a second surface side, the second hole has a third opening on a first conductive layer side and a fourth opening on a basement side, and the third opening is larger than the first opening. ### Claim 2 (depends on 1) The electronic device according to claim 1, wherein the second hole has a shape that a width increases from the fourth opening to the third opening in a sectional view. ### Claim 3 (depends on 1) The electronic device according to claim 1, wherein the first conductive layer has a flat area which closes the third opening, and the connecting material is in contact with the area. ### Claim 4 (depends on 1) The electronic device according to claim 1, wherein the insulating layer includes a sealing material which attaches the first substrate and the second substrate to each other. ### Claim 5 (depends on 1) The electronic device according to claim 1, wherein the fourth opening is larger than the first opening. ### Claim 6 (depends on 1) The electronic device according to claim 1, wherein the first opening is larger than the second opening. ### Claim 7 (depends on 1) The electronic device according to claim 1, wherein the first opening is smaller than the second opening. ### Claim 8 (depends on 1) The electronic device according to claim 1, wherein the first hole has a shape that a width increases from the first opening toward the second opening in a sectional view. ### Claim 9 (depends on 1) The electronic device according to claim 1, wherein the first hole has an intermediate portion which is located between the first opening and the second opening, and the first hole has a shape that a width decreases from the first opening toward the intermediate portion and increases from the intermediate portion toward the second opening in a sectional view. ### Claim 10 (depends on 9) The electronic device according to claim 9, wherein the first opening is smaller than the second opening. ### Claim 11 (depends on 1) The electronic device according to claim 1, wherein the connecting material covers an inner surface of the first hole and an inner surface of the second hole. ### Claim 12 (depends on 1) The electronic device according to claim 1, wherein the connecting material covers the second surface and the second conductive layer covers the connecting material in a circumference of the first hole. ### Claim 13 (depends on 1) The electronic device according to claim 1, wherein the connecting material inside the first hole is formed between the second conductive layer and an inner surface of the first hole. ### Claim 14 (depends on 1) The electronic device according to claim 1, wherein the second conductive layer inside the first hole is formed between the connecting material and an inner surface of the first hole. ### Claim 15 (depends on 1) The electronic device according to claim 1, further comprising a protection layer which covers the second conductive layer and the connecting material. ### Claim 16 (depends on 15) The electronic device according to claim 15, wherein the protection layer includes a first protection layer which covers the second conductive layer, and a second protection layer which covers the connecting material. ### Claim 17 (depends on 16) The electronic device according to claim 16, wherein the second hole is filled with the second protection layer. ### Claim 18 (depends on 1) The electronic device according to claim 1, wherein the second conductive layer includes a detector which detects an object in contact with or in proximity to the first area, and a terminal which is arranged in a second area adjacent to the first area and is connected to the detector, and the first hole and the second hole are located in a position which overlaps the terminal in a plan view. ### Claim 19 (depends on 18) The electronic device according to claim 18, further comprising a detection circuit which is electrically connected to the first conductive layer and reads a sensor signal output from the second conductive layer. ### Claim 20 (depends on 18) The electronic device according to claim 18, wherein the first substrate includes a driving electrode which is opposed to the second conductive layer.