# US 10,120,423 B1 · Unibody thermal enclosure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,120,423 B1 - Document ID: US10120423B1 - Status: Granted - Kind: B1 - Application number: 14/849,350 - Filed: 2015-09-09 - Granted: 2018-11-06 - Earliest claimed: 2015-09-09 - Assignees: Amazon Technologies, Inc. - Applicants: Amazon Technologies, Inc. - Inventors: Bradley David Urban; Troy Hulick; Shelomon Patrick Doblack; Robert Olson; Albert John Yu Sam Chua; Daniel Jones; Adam Kenneth Cybart; Gaurav Soni; William James Carter-Giannini; Matthew Michael Seflic - Web page: https://patentgrep.com/patent/US10120423B1 ## CPC - H05K 7/20436: {Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing} - G06F 1/1656: {Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203)} - G06F 1/203: {for portable computers, e.g. for laptops} - H04M 1/0202: {Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets (constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03)} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08) ## Abstract Described herein are unibody thermal enclosures for electronic devices. In some instances, the enclosure is a unibody structure formed by injecting a structural material into the tool suspending thermal absorbing/spreading material and thermal insulating material within a cavity of the tool. In other instances, the thermal absorbing/spreading material may be exposed to circuitry of the electronic device and the thermal insulating material may be exposed to the exterior of the electronic device. ## Claims ### Claim 1 An enclosure comprising: a thermal insulating material positioned proximate to a surface of the enclosure exposed to an external environment; a structural material in contact with the thermal insulating material, the structural material and the thermal insulating material forming a single unibody component; and a heat absorbing material disposed substantially laterally between two portions of a heat spreading material such that the heat absorbing material and the two portions of the heat spreading material are disposed within a single layer that is disposed on an interior surface of the enclosure, and wherein the heat absorbing material includes a first metal that is different from a second metal of the heat spreading material. ### Claim 2 (depends on 1) The enclosure as recited in claim 1, wherein the two portions of the heat spreading material are positioned proximate to at least one internal electronic component, and the heat spreading material is integral with the structural material. ### Claim 3 (depends on 1) The enclosure as recited in claim 1, wherein the heat spreading material includes at least one of: copper; aluminum; or copper based alloy. ### Claim 4 (depends on 1) The enclosure as recited in claim 1, wherein the heat absorbing material is positioned proximate to at least one internal electronic component, and the heat absorbing material is integral with the structural material. ### Claim 5 (depends on 1) The enclosure as recited in claim 1, wherein the heat absorbing material includes at least one of: graphite; magnesium; or zinc. ### Claim 6 (depends on 1) The enclosure as recited in claim 1, wherein the structural material is a thermal set material. ### Claim 7 (depends on 1) The enclosure as recited in claim 1, wherein the structural material is a thermal plastic. ### Claim 8 (depends on 1) The enclosure as recited in claim 1, wherein the thermal insulating material is exposed to the external environment. ### Claim 9 (depends on 1) The enclosure as recited in claim 1, wherein the thermal insulating material includes at least one of: balsam wood; plastic polymer; rubber; or foam. ### Claim 10 (depends on 1) The electronic device as recited in claim 1, wherein the thermal insulating material remains below 50° C. during use of at least one internal electronic component proximate to the heat absorbing material. ### Claim 11 (depends on 1) The enclosure as recited in claim 1, wherein: the enclosure further comprises a first additional surface and a second additional surface, the first additional surface and the second additional surface disposed substantially perpendicular with respect to the surface of the enclosure exposed to the external environment and the first additional surface being disposed substantially parallel to the second additional surface; the thermal insulating material is disposed on at least a portion of the first additional surface and a portion of the second additional surface; and the structural material is disposed between the thermal insulating material and the single layer including the heat absorbing material and the two portions of the heat spreading material. ### Claim 12 A unibody thermal enclosure comprising: an exterior surface including a thermal insulating material, the exterior surface exposed to an external environment; an interior surface, at least a portion of the interior surface including a heat spreading material and a heat absorbing material, wherein the heat spreading material and the heat absorbing material are disposed substantially laterally in a single layer on the interior surface and the heat absorbing material includes a first metal that is different from a second metal of the heat spreading material; and a structural material disposed around and in contact with the thermal insulating material, the heat spreading material, and the heat absorbing material. ### Claim 13 (depends on 12) The unibody thermal enclosure as recited in claim 12, wherein the structural material is a thermal plastic material. ### Claim 14 (depends on 12) The unibody thermal enclosure as recited in claim 12, wherein the thermal insulating material remains below a first temperature during use of the unibody thermal enclosure. ### Claim 15 (depends on 14) The unibody thermal enclosure as recited in claim 14, wherein the heat absorbing material is disposed over a portion of the interior surface that corresponds to a hot spot that includes circuitry of an electronic device. ### Claim 16 (depends on 15) The unibody thermal enclosure as recited in claim 15, wherein the thermal insulating material causes the circuitry to remain below a second temperature, the second temperature being higher than the first temperature. ### Claim 17 (depends on 14) The unibody thermal enclosure as recited in claim 14, wherein the thermal insulting material remains below 50° C. during use of circuitry proximate to the heat absorbing material. ### Claim 18 (depends on 12) The unibody thermal enclosure as recited in claim 12, wherein the first metal includes zinc and the second metal includes copper or aluminum. ### Claim 19 An enclosure comprising: an external surface exposed to an external environment; a thermal insulating material proximate to the external surface; an internal surface proximate to an internal electronic component; a heat absorbing material disposed substantially laterally between two portions of a heat spreading material such that the heat absorbing material and the heat spreading material are disposed in a single layer on the internal surface; and a structural material in contact with the thermal insulating material, the structural material and the thermal insulating material forming a single unibody component. ### Claim 20 (depends on 19) The enclosure as recited in claim 19, wherein the heat absorbing material includes a first metal that is different from a second metal of the heat spreading material.