# US 10,120,277 B2 · Radiation-sensitive composition and pattern-forming method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,120,277 B2 - Document ID: US10120277B2 - Status: Granted - Kind: B2 - Application number: 15/436,009 - Filed: 2017-02-17 - Published: 2017-08-24 - Granted: 2018-11-06 - Earliest claimed: 2016-02-19 - Assignees: Jsr Corporation; Cornell University - Applicants: Jsr Corporation; Cornell University - Inventors: Kazuki Kasahara; Vasiliki Kosma; Jeremy Odent; Hong Xu; Mufei Yu; Emmanuel P. Giannelis; Christopher K. Ober - Web page: https://patentgrep.com/patent/US10120277B2 ## CPC - G03F 7/0043: {Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof (G03F7/0044 takes precedence)} - B32B 5/16: characterised by features of a layer formed of particles, e.g. chips, powder {or granules (layer formed of natural mineral particles B32B19/00; layer being formed of wood fibres, chips or particles B32B21/02)} - G03F 7/0042: {with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists (G03F7/075 takes precedence)} - G03F 7/0045: {with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors} - G03F 7/092: {characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means} - G03F 7/162: {Coating on a rotating support, e.g. using a whirler or a spinner} - G03F 7/168: {Finishing the coated layer, e.g. drying, baking, soaking} - G03F 7/2004: {characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light} - G03F 7/2037: {Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation} - G03F 7/322: {Aqueous alkaline compositions} - G03F 7/325: {Non-aqueous compositions} - G03F 7/38: Treatment before imagewise removal, e.g. prebaking {(G03F7/265 takes precedence)} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ## Abstract A radiation-sensitive composition includes particles including a metal oxide as a principal component, and an organic solvent. A metal atom constituting the metal oxide includes a first metal atom that is a zinc atom, a boron atom, an aluminum atom, a gallium atom, a thallium atom, a germanium atom, an antimony atom, a bismuth atom, a tellurium atom, or a combination thereof. A percentage content of the first metal atom with respect to total metal atoms in the radiation-sensitive composition is no less than 50 atomic %. A pattern-forming method includes applying the radiation-sensitive composition to form a film on a substrate, exposing the film, and developing the film exposed. ## Claims ### Claim 1 A radiation-sensitive composition comprising: particles comprising a metal oxide as a principal component; a radiation-sensitive acid generator selected from the group consisting of a N-sulfonyloxyimide compound, a diazo ketone compound, and a combination thereof; and an organic solvent, wherein: the metal oxide comprises at least one metal atom selected from the group consisting of a zinc atom, a boron atom, an aluminum atom, a gallium atom, a thallium atom, a germanium atom, an antimony atom, a bismuth atom, and a tellurium atom; a van der Waals volume of an acid generated from the radiation-sensitive acid generator is less than 2.0×10−28 m3; and a percentage content of the at least one metal atom with respect to total metal atoms in the radiation-sensitive composition is no less than 50 atomic %. ### Claim 2 (depends on 1) The radiation-sensitive composition according to claim 1, wherein an average particle diameter of the particles is no greater than 20 nm. ### Claim 3 (depends on 1) The radiation-sensitive composition according to claim 1, wherein the particles further comprise a ligand derived from an organic acid. ### Claim 4 (depends on 3) The radiation-sensitive composition according to claim 3, wherein the organic acid is at least one selected from the group consisting of a carboxylic acid, a sulfonic acid, a sulfinic acid, an organic phosphinic acid, an organic phosphonic acid, a phenol, an enol, a thiol, an acid imide, an oxime, and a sulfonamide. ### Claim 5 (depends on 3) The radiation-sensitive composition according to claim 3, wherein the organic acid is a carboxylic acid. ### Claim 6 (depends on 3) The radiation-sensitive composition according to claim 3, wherein the organic acid is a monocarboxylic acid. ### Claim 7 (depends on 3) The radiation-sensitive composition according to claim 3, wherein the organic acid is at least one selected from the group consisting of methacrylic acid, tiglic acid, benzoic acid, m-toluic acid, o-toluic acid, and 3-iodobenzoic acid. ### Claim 8 (depends on 3) The radiation-sensitive composition according to claim 3, wherein a percentage content of the ligand derived from the organic acid is from 40 to 95% by mass. ### Claim 9 (depends on 3) The radiation-sensitive composition according to claim 3, wherein a percentage content of the ligand derived from the organic acid is from 60 to 90% by mass. ### Claim 10 (depends on 1) The radiation-sensitive composition according to claim 1, wherein the metal oxide comprises zinc and a ligand derived from benzoic acid. ### Claim 11 (depends on 1) The radiation-sensitive composition according to claim 1, wherein the percentage content of the at least one metal atom with respect to the total metal atoms in the radiation-sensitive composition is no less than 80 atomic %. ### Claim 12 (depends on 1) The radiation-sensitive composition according to claim 1, wherein the percentage content of the at least one metal atom with respect to the total metal atoms in the radiation-sensitive composition is no less than 95 atomic %. ### Claim 13 (depends on 1) The radiation-sensitive composition according to claim 1, wherein the number of the at least one metal atom in the particles is from 2 to 6. ### Claim 14 (depends on 1) A pattern-forming method comprising: applying the radiation-sensitive composition according to claim 1 to form a film on a substrate; exposing the film; and developing the film exposed. ### Claim 15 (depends on 14) The pattern-forming method according to claim 14, wherein a developer solution used in the developing is an alkaline aqueous solution. ### Claim 16 (depends on 15) The pattern-forming method according to claim 15, wherein a radioactive ray used in the exposing is an extreme ultraviolet ray or an electron beam. ### Claim 17 (depends on 14) The pattern-forming method according to claim 14, wherein a developer solution used in the developing is an organic solvent-containing liquid. ### Claim 18 (depends on 17) The pattern-forming method according to claim 17, wherein a radioactive ray used in the exposing is an extreme ultraviolet ray or an electron beam. ### Claim 19 (depends on 14) The pattern-forming method according to claim 14, wherein a radioactive ray used in the exposing is an extreme ultraviolet ray or an electron beam. ### Claim 20 (depends on 3) The radiation-sensitive composition according to claim 3, wherein the radiation-sensitive composition consists of: the particles; the radiation-sensitive acid generator; the solvent; optionally, a ligand other than the ligand derived from the organic acid; and optionally, a surfactant.