# US 10,120,151 B1 · System and methods for cooling optical components

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- Number: US 10,120,151 B1
- Document ID: US10120151B1
- Status: Granted
- Kind: B1
- Application number: 14/640,863
- Filed: 2015-03-06
- Granted: 2018-11-06
- Earliest claimed: 2015-03-06
- Assignees: Science Research Laboratory, Inc.
- Applicants: Aland K. Chin; Richard H. Chin; Alan Nelson
- Inventors: Aland K. Chin; Richard H. Chin; Alan Nelson
- Web page: https://patentgrep.com/patent/US10120151B1

## CPC

- G02B 6/4296: {coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources}
- G02B 6/4272: {with mounting substrates of high thermal conductivity}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

A cooling device includes a thermally conductive object having an opening configured to receive an optical component, the opening being configured such that the optical component is thermally and optically operationally connected to the thermally conductive and electrically conductive object. One or more cooling components, microchannel coolers in one instance, are also thermally operationally connected to the thermally conductive and electrically conductive object. Methods of use are disclosed.

## Claims

### Claim 1

A cooling device comprising:
a thermally conductive metal object having an opening configured to receive a fiber optic connector, the opening being configured such that the received fiber optic connector is thermally and optically operatively connected to the thermally conductive metal object; a solid portion of the thermally conductive metal object being configured to completely wrap around the fiber optic connector; and
one or more microchannel coolers thermally operatively connected to the thermally conductive metal object; the cooling device configured to remove more than 500 Watts of waste optical power from the fiber optic connector.

### Claim 2 (depends on 1)

The cooling device of claim 1 wherein the thermally conductive metal object is configured to absorb waste optical power from the fiber optic connector.

### Claim 3 (depends on 1)

The cooling device of claim 1 wherein the thermally conductive metal object comprises at least one of copper, silver or aluminum.

### Claim 4 (depends on 1)

The cooling device of claim 1 wherein the thermally conductive metal object comprises:
a thin-film disposed on an internal surface of the opening; the thin film having an absorption coefficient in an operating spectral region of the fiber optic connector that exceeds an absorption coefficient of the metal object.

### Claim 5 (depends on 1)

The cooling device of claim 1 wherein the microchannel coolers are copper-based microchannel coolers.

### Claim 6 (depends on 5)

The cooling device of claim 5 wherein the coolant solution used in the microchannel coolers comprises a solution of water and ethanol.

### Claim 7 (depends on 1)

The cooling device of claim 1 wherein the one or more microchannel coolers are operatively connected to the thermally conductive metal object by soldering the one or more cooling components to the thermally conductive metal object.

### Claim 8 (depends on 1)

The cooling device of claim 1 wherein the fiber optic connector is a fiber optic mode stripper.

### Claim 9 (depends on 1)

The cooling device of claim 1 wherein the fiber optic connector is a tapered fused-fiber combiner.

### Claim 10

A method for removing more than 500 Watts of waste optical power from a fiber optic connector, the method comprising:
inserting the fiber optic connector in an opening in a thermally conductive metal object; the opening being configured such that the fiber optic connector is thermally and optically operatively connected to the thermally conductive object; wherein at least a solid portion of the thermally conductive metal object completely wraps around the fiber optic connector; and
thermally operatively connecting one or more microchannel coolers to the thermally conductive metal object;
waste optical power from the optical component being substantially absorbed by the thermally conductive object and heat generated by absorbed waste optical power being removed by the one or more microchannel coolers wherein more than 500 Watts of the waste optical power can be removed.

### Claim 11 (depends on 10)

The method of claim 10 wherein the thermally conductive metal object comprises at least one of copper, silver or aluminum.

### Claim 12 (depends on 10)

The method of claim 10 wherein the thermally conductive metal object comprises:
a thin-film disposed on an internal surface of the opening; the thin film having an absorption coefficient in an operating spectral region of the optical component that exceeds an absorption coefficient of the metal object.

### Claim 13 (depends on 10)

The method of claim 10 wherein the opening in a thermally conductive metal object is configured such that the fiber optic connector is a fiber optic mode stripper.

### Claim 14 (depends on 10)

The method of claim 10 wherein the opening in a thermally conductive metal object is configured such that the fiber optic connector is a tapered fused-fiber combiner.