# US 10,119,888 B2 · Temperature sensor integrated type semiconductor pressure sensor apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,119,888 B2 - Document ID: US10119888B2 - Status: Granted - Kind: B2 - Application number: 15/216,001 - Filed: 2016-07-21 - Published: 2017-10-12 - Granted: 2018-11-06 - Earliest claimed: 2016-04-06 - Assignees: Mitsubishi Electric Corporation - Applicants: Mitsubishi Electric Corporation - Inventors: Hiroyuki Kishimoto - Web page: https://patentgrep.com/patent/US10119888B2 ## CPC - G01M 15/05: by combined monitoring of two or more different engine parameters - G01K 1/10: for preventing chemical attack - G01K 1/16: Special arrangements for conducting heat from the object to the sensitive element - G01K 7/22: the element being a non-linear resistance, e.g. thermistor (G01K7/26 takes precedence) - G01K 13/02: for measuring temperature of moving fluids or granular materials capable of flow - G01L 9/0054: {integral with a semiconducting diaphragm} - G01L 19/0092: {Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature (G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26)} - G01L 19/142: {Multiple part housings} - G01K 13/024: of moving gases - G01K 2205/02: for measuring inlet gas temperature - G01M: TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR - G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00) - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) ## Abstract A temperature sensor integrated type semiconductor pressure sensor apparatus includes a temperature detection device, a lead wire covered with a lead wire protection material, and a terminal, which are integrated together by a thermoplastic resin. This can prevent the lead wire from being deformed in the assembly process, thereby simplifying the assembly process. Furthermore, the temperature detection device is exposed from the opening at the tip of the protrusion, which can secure enough temperature response. Furthermore, the temperature detection device, the lead wire and the lead wire protection material are covered with the thermoplastic resin, so they are protected from combustion gas component, oil contaminant and corrosion product included in intake air. ## Claims ### Claim 1 A temperature sensor integrated type semiconductor pressure sensor apparatus in which a pressure sensor module and a temperature sensor module are contained in a resin enclosure, wherein the resin enclosure includes: a pressure guiding path containing a pressure detection device of the pressure sensor module; a container provided adjacent to the pressure guiding path, containing the temperature sensor module; and a protrusion provided such that part of the container protrudes further than an inlet of the pressure guiding path, wherein the temperature sensor module includes: a temperature detection device fixed at the tip of the protrusion; a lead wire covered with a lead wire protection material; a terminal connected to the temperature detection device via the lead wire; and a resin covering the temperature detection device, the lead wire covered with the lead wire protection material, and the terminal, and wherein the temperature detection device, the lead wire and the terminal are integrated together by the resin, and wherein a portion of the resin is provided between the lead wire protection material and an inner space of the container. ### Claim 2 (depends on 1) The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 1, wherein the inner space of the container is formed to narrow toward the tip of the protrusion. ### Claim 3 (depends on 1) The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 1, wherein the protrusion has an opening at a tip of the protrusion, and the temperature detection device is placed outside the container through the opening. ### Claim 4 (depends on 3) The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 3, wherein the protrusion is cylindrical and has a concave portion at the outer edge of the opening that is more recessed than the remaining part, and wherein a seal member is provided to seal the gap between the resin of the temperature sensor module and the opening, and is fitted into the concave portion and fixed. ### Claim 5 (depends on 4) The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 4, wherein the seal member covers the temperature detection device with the resin in between. ### Claim 6 (depends on 4) The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 4, wherein the seal member is an O-ring or a packing. ### Claim 7 (depends on 1) The temperature sensor integrated type semiconductor pressure sensor apparatus according to claim 1, wherein the resin is a thermoplastic resin.