# US 10,119,877 B2 · High-temperature headers for sensing elements > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,119,877 B2 - Document ID: US10119877B2 - Status: Granted - Kind: B2 - Application number: 15/211,610 - Filed: 2016-07-15 - Published: 2017-01-19 - Granted: 2018-11-06 - Earliest claimed: 2015-07-16 - Assignees: Kulite Semiconductor Products, Inc. - Applicants: Kulite Semiconductor Products, Inc. - Inventors: Alexander Ned; Sorin Stefanescu; Scott Goodman - Web page: https://patentgrep.com/patent/US10119877B2 ## CPC - G01L 19/0681: {Protection against excessive heat} - G01L 19/04: Means for compensating for effects of changes of temperature {, i.e. other than electric compensation} - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) ## Abstract Certain implementations of the disclosed technology include systems and methods for providing header assemblies for use with pressure sensors in high-temperature environments. Certain example implementations include a header assembly. The header assembly can include a header portion having a first side and a second side, the header portion including one or more bores extending through the header portion from the first side to the second side. In certain example implementations, one or more platinum header pins are disposed within and extending through the one or more bores of the header portion. In certain example implementations, the header assembly can include one or more brazing portions corresponding to the one or more platinum header pins. In certain example implementations, the platinum header pins are configured for electrical communication with corresponding electrodes of a leadless transducer element. ## Claims ### Claim 1 A transducer assembly, comprising: a leadless transducer element, the leadless transducer element comprising: one or more electrode portions; and one or more interconnect regions in communication with the corresponding one or more electrode portions; a header assembly in communication with the leadless transducer element, the header assembly, comprising: a header portion having a first side and a second side, the header portion comprising one or more bores extending through the header portion from the first side to the second side; one or more platinum header pins disposed within and extending through the one or more bores of the header portion, the one or more platinum header pins protruding partially into the corresponding one or more interconnection regions; and one or more brazing portions corresponding to the one or more platinum header pins, wherein the one or more brazing portions seal the one or more platinum header pins to inner walls of the corresponding one or more bores; wherein the one or more interconnect regions are in electrical communication with the corresponding one or more platinum header pins; wherein the interconnect regions comprise a platinum-based glass frit to electrically connect the one or more platinum header pins of the header assembly to the corresponding one or more electrode portions of the leadless transducer element; wherein the leadless transducer assembly is configured to operate in environments having temperatures ranging from about 500° C. to about 700° C. ### Claim 2 (depends on 1) The transducer assembly of claim 1, wherein the interconnect regions comprise a platinum-based glass frit to electrically connect the one or more platinum header pins of the header assembly to the corresponding one or more electrode portions of the leadless transducer element, wherein the one or more platinum header pins are not in direct contact with the corresponding one or more electrode portions. ### Claim 3 (depends on 1) The transducer assembly of claim 1, wherein the header portion comprises aluminum nitride (AlN). ### Claim 4 (depends on 1) The transducer assembly of claim 1, wherein the header portion comprises one or more of gallium nitride (GaN), silicon nitride (Si3N4), and silicon carbide (SiC). ### Claim 5 (depends on 1) The transducer assembly of claim 1, wherein the brazing portions form a hermetic seal from the first side to the second side of the header portion. ### Claim 6 (depends on 1) The transducer assembly of claim 1, further comprising a header shell in contact and at least partially surrounding the header portion. ### Claim 7 (depends on 1) The transducer assembly of claim 1, wherein the leadless transducer element is configured to measure a pressure. ### Claim 8 (depends on 1) The transducer assembly of claim 1, wherein the leadless transducer element and the header assembly are hermetically sealed. ### Claim 9 (depends on 1) The transducer assembly of claim 1, wherein the leadless transducer assembly is configured to operate in environments having temperatures ranging from about 100° C. to about 500° C. ### Claim 10 A transducer assembly, comprising: a transducer element, the transducer element comprising: one or more electrode portions; and one or more interconnect regions in communication with the corresponding one or more electrode portions; a header assembly in communication with the transducer element, the header assembly, comprising: a header portion having a first side and a second side, the header portion comprising one or more bores extending through the header portion from the first side to the second side; one or more header pins disposed within and extending through the one or more bores of the header portion, the one or more header pins comprising a platinum material, the one or more header pins protruding partially into and in electrical communication with the corresponding one or more interconnection regions; and one or more brazing portions corresponding to the one or more header pins, wherein the one or more brazing portions seal the one or more header pins to inner walls of the corresponding one or more bores, wherein the interconnect regions comprise a platinum-based glass frit to electrically connect the one or more header pins of the header assembly to the corresponding one or more electrode portions of the transducer element. ### Claim 11 (depends on 10) The transducer assembly of claim 10, wherein the header portion comprises aluminum nitride (AlN). ### Claim 12 (depends on 10) The transducer assembly of claim 10, wherein the header portion comprises one or more of gallium nitride (GaN), silicon nitride (Si3N4), and silicon carbide (SiC). ### Claim 13 (depends on 10) The transducer assembly of claim 10, wherein the brazing portions form a hermetic seal from the first side to the second side of the header portion. ### Claim 14 (depends on 10) The transducer assembly of claim 10, further comprising a header shell in contact and at least partially surrounding the header portion. ### Claim 15 A method, comprising: mounting a header assembly to a leadless transducer assembly, wherein the leadless transducer assembly comprises: a transducer element, comprising: one or more electrode portions; one or more interconnect regions in communication with the corresponding one or more electrode portions; wherein the header assembly comprises: a header portion having a first side and a second side, the header portion comprising one or more bores extending through the header portion from the first side to the second side; inserting one or more platinum header pins within and extending through the one or more bores of the header portion, the one or more header pins protruding partially into and in electrical communication with the corresponding one or more interconnection regions; brazing the one or more platinum header pins to inner walls of the corresponding one or more bores; and joining the header assembly to the leadless transducer assembly such that one or more interconnect regions are in electrical communication with the corresponding one or more platinum header pins. ### Claim 16 (depends on 15) The method of claim 15, wherein the interconnect regions comprise a platinum-based glass frit to electrically connect the one or more platinum header pins of the header assembly to the corresponding one or more electrode portions of the transducer element. ### Claim 17 (depends on 15) The method of claim 15, wherein the header portion comprises aluminum nitride (AlN). ### Claim 18 (depends on 15) The method of claim 15, wherein the header portion comprises one or more of gallium nitride (GaN), silicon nitride (Si3N4), and silicon carbide (SiC). ### Claim 19 (depends on 15) The method of claim 15, wherein the brazing forms a hermetic seal from the first side to the second side of the header portion. ### Claim 20 (depends on 15) The method of claim 15, joining the header assembly to the leadless transducer assembly comprises one or more of: brazing, thermally matched sealing, compression sealing, and glass frit sealing.