# US 10,119,696 B2 · Amplification circuit and heat sink used with a light emitting apparatus having varying voltages

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- Number: US 10,119,696 B2
- Document ID: US10119696B2
- Status: Granted
- Kind: B2
- Application number: 13/764,885
- Filed: 2013-02-12
- Published: 2013-06-20
- Granted: 2018-11-06
- Earliest claimed: 2007-06-25
- Assignees: Ingersoll-Rand Company
- Applicants: Ingersoll-Rand Company
- Inventors: Vikram Madineni; Jason Bartoszek
- Web page: https://patentgrep.com/patent/US10119696B2

## CPC

- F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks
- H05B 45/325: Pulse-width modulation [PWM]
- H05B 45/375: using buck topology
- H05B 45/397: Current mirror circuits
- Y02B 20/30: Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS

## Abstract

A light emitting apparatus having a housing including a portion defining a thermally conductive outer surface, a light source positioned within the housing, and an internal heat sink thermally coupling the light source and the thermally conductive outer surface portion of the housing. The light source may be a solid state device, such as a light emitting diode.

## Claims

### Claim 1

A light emitting apparatus comprising:
a housing including a portion defining a thermally conductive outer surface;
a high power LED light source positioned within the housing, wherein photometric output of the high power LED increases proportionately with supplied current, and wherein the high power LED is electrically coupled to a voltage source, and a pulse width modulation controller for controlling a duty cycle of supplied input voltage;
a lens housed by the housing and aligned with the light source; and
an internal heat sink located to thermally couple with the high power LED light source and conduct heat away from the light source, independent of another conducting medium, and transfer the conducted heat to the thermally conductive outer surface portion of the housing, upon being connected to the thermally conductive outer surface;
wherein a junction temperature of the high power LED is maintained and controlled through the thermal coupling of the high power LED light source, the internal heat sink and the conductive outer surface portion of the housing.

### Claim 2 (depends on 1)

The light emitting apparatus according to claim 1, wherein the housing includes a plurality of components.

### Claim 3 (depends on 2)

The light emitting apparatus according to claim 2, wherein at least one component of the housing includes at least a portion of the internal heat sink.

### Claim 4 (depends on 1)

The light emitting apparatus according to claim 1, wherein at least a portion of the housing comprises a thermally conductive material.

### Claim 5 (depends on 1)

The light emitting apparatus according to claim 1, wherein at least a portion of the housing is metallic.

### Claim 6 (depends on 1)

The light emitting apparatus according to claim 1, wherein the portion of the housing includes a finished aluminum surface.

### Claim 7 (depends on 1)

The light emitting apparatus according to claim 1, wherein the light source is a solid state device.

### Claim 8 (depends on 1)

The light emitting apparatus according to claim 1, wherein the light source is mounted on the heat sink.