# US 10,119,052 B2 · Robust interface bonding with B-staged thermoplastic polyimide adhesive

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- Number: US 10,119,052 B2
- Document ID: US10119052B2
- Status: Granted
- Kind: B2
- Application number: 15/395,140
- Filed: 2016-12-30
- Published: 2017-05-25
- Granted: 2018-11-06
- Earliest claimed: 2013-08-21
- Assignees: Fraivillig Technologies Company
- Applicants: James B. Fraivillig
- Inventors: James B. Fraivillig
- Web page: https://patentgrep.com/patent/US10119052B2

## CPC

- C09J 179/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- B05D 1/26: performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
- B05D 1/28: performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
- B05D 1/283: {Transferring monomolecular layers or solutions of molecules adapted for forming monomolecular layers from carrying elements}
- B05D 3/108: {Curing}
- B05D 3/144: {of polymeric substrates}
- B32B 27/281: {comprising polyimides}
- B32B 37/1207: {Heat-activated adhesive (B32B37/04 takes precedence)}
- C09J 5/06: involving heating of the applied adhesive
- C09J 7/35: Heat-activated
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/304: the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
- C09J 2477/00: Presence of polyamide
- C09J 2479/08: polyimide
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

## Abstract

Thermoplastic Polyimide (TPI) polymer adhesive coated laminating films in which the TPI coating is under cured or B-staged as well as the process for preparing the films and the use thereof is disclosed.

## Claims

### Claim 1

A method for bonding two surfaces utilizing a heat activated thermoplastic adhesive, said method comprising in combination:
A. providing a substrate comprising a first of said surfaces; and
B. coating said heat activated thermoplastic adhesive on said substrate, said adhesive comprising in combination:
i. a solvent; and
ii. a mixture of polyamic-acid polymer and thermoplastic polyimide polymer solids disposed in said solvent, said mixture containing no less than 10% and no greater than 50% thermoplastic polyimide of the total polymer mass and said mixture further containing an amount of solvent of between 20 and 60% of the total mass of the mixture,
said adhesive forming an adhesive bondline between said surfaces;
C. providing a second of said surfaces;
D. positioning the adhesive side of said first surface in contact with said second surface to form an unbonded laminate;
E. applying heat and pressure to said unbonded laminate to:
i. outgas said solvent from said adhesive bondline;
ii. substantially convert all of said polyamic-acid polymer to said thermoplastic polyimide polymer, said conversion generating a quantity of water vapor,
iii. outgas said water vapor from said adhesive bondline; and
iv. bond said surfaces at the completion of said outgassing.

### Claim 2 (depends on 1)

The method of claim 1 further including the further step of applying additional higher pressure to said laminate to enhance said bond.

### Claim 3 (depends on 1)

The method of claim 1 wherein said solvent is selected from the group consisting of N-methyl-2-pyrrolidone (NMP) and dimethylacetamide (DMAC).

### Claim 4 (depends on 1)

The method of claim 1 wherein said polyamic-acid polymer comprises a mixture of diamine and dianhydride monomers, said diamine monomer is selected from the group consisting of
3,5-diaminobenzoic acid (DABA), 3,3′-diaminobenzophenone (3,3′-DABP), 3,4′-diaminobenzophenone (3,4′-DABP), 1,3-Bis (4-aminophenoxy) benzene (TPER), 3,4′-Oxydianiline (3,4′-ODA), 4,4′-Oxydianiline (4,4′-ODA), 4,4′-Methylene dianiline (4,4′-MDA), an aliphatic diamine, and a silicon-diamine; and said dianhydride monomer is selected from the group consisting of 3,3′,4,4′-Biphenyltetracarboxylic dianhydride (BPDA), 3,3′,4,4′-Benzophenone tetracarboxylic dianhydride (BTDA), 4,4′-Oxydiphthalic anhydride (ODPA), Pyromellitic dianhydride (PMDA), and 2,2′-Bis-(3,4-Dicarboxyphenyl) hexafluoropropane dianhydride (6FDA).