# US 10,118,560 B2 · Unitary housing for electronic device

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- Number: US 10,118,560 B2
- Document ID: US10118560B2
- Status: Granted
- Kind: B2
- Application number: 15/078,960
- Filed: 2016-03-23
- Published: 2016-07-14
- Granted: 2018-11-06
- Earliest claimed: 2010-11-12
- Assignees: Apple Inc.
- Applicants: Apple Inc.
- Inventors: Christopher D. Prest; Stephen P. Zadesky; Trent Weber; Lucy E. Browning
- Web page: https://patentgrep.com/patent/US10118560B2

## CPC

- G06F 1/181: {Enclosures (for portable computers G06F1/1613)}
- A45C 11/00: Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 (specially adapted for toiletry or cosmetic equipment A45D29/20, A45D44/18; travelling sewing kits A45F3/48)
- B60R 7/04: in driver or passenger space {, e.g. using racks (B60R7/005, B60R7/08 take precedence)}
- B60R 11/0211: {for record carriers apparatus, e.g. video recorders, tape players or CD players}
- B60R 11/0241: {for telephones}
- B60R 11/0252: {for personal computers, e.g. laptops, notebooks}
- G06F 1/1656: {Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203)}
- H05K 5/04: Metal casings
- H05K 5/069: {Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft}
- H05K 5/10: comprising several parts forming a closed casing
- H05K 5/30: Side-by-side or stacked arrangements
- H05K 13/00: Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H10W 76/12: characterised by their shape
- H10W 76/13: Containers comprising a conductive base serving as an interconnection
- H10W 76/134: having other interconnections parallel to the conductive base
- H10W 76/15: Containers comprising an insulating or insulated base
- H10W 76/157: having interconnections parallel to the insulating or insulated base
- H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
- H10W 76/60: Seals
- A45C 11/001: {for storing portable audio devices, e.g. headphones or digital music players}
- A45C 11/002: {for storing portable handheld communication devices, e.g. pagers or smart phones}
- A45C 11/003: {for storing portable computing devices, e.g. laptops, tablets or calculators}
- B60R 2011/0003: {inside the vehicle}
- B60R 2011/0057: {using magnetic means}
- Y10T 29/302: Clad or other composite foil or thin metal making
- Y10T 29/49002: Electrical device making
- Y10T 29/49826: Assembling or joining
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- A45C: PURSES; LUGGAGE; HAND CARRIED BAGS
- B60R: VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

## Claims

### Claim 1

A laptop computer, comprising:
a base portion comprising:
metal layers at least some of which are bonded together by metal to metal bonds; and
an opening to an internal cavity, the internal cavity defined at least in part by the metal layers, the internal cavity being suitable for accommodating an operational component.

### Claim 2 (depends on 1)

The laptop computer as recited in claim 1, wherein the base portion is characterized as having a seamless outer surface.

### Claim 3 (depends on 2)

The laptop computer as recited in claim 2, further comprising:
a cover metal layer bonded to the base portion that covers the opening to the internal cavity, thereby enclosing the operational component within the internal cavity.

### Claim 4 (depends on 3)

The laptop computer as recited in claim 3, wherein the cover metal layer is seamlessly bonded to the base portion.

### Claim 5 (depends on 3)

The laptop computer as recited in claim 3, wherein the cover metal layer is approximately a same thickness as at least some of the metal layers.

### Claim 6 (depends on 5)

The laptop computer as recited in claim 5, further comprising:
a top portion movably coupled to the base portion.

### Claim 7 (depends on 6)

The laptop computer as recited in claim 6, wherein the top portion is formed from a material that is different from the cover metal layer or the metal layers.

### Claim 8 (depends on 1)

The laptop computer as recited in claim 1, wherein most of the metal layers have about a same thickness.

### Claim 9

A housing for a laptop, comprising:
a bottom portion comprising:
a layered stack that includes metal layers that are fixed together by a material in a manner that defines at least in part: (i) an internal cavity, and (ii) an opening suitable for receiving an operational component for placement within or removal from the internal cavity.

### Claim 10 (depends on 9)

The housing as recited in claim 9, wherein at least some of the metal layers are characterized as having an approximately uniform thickness.

### Claim 11 (depends on 9)

The housing as recited in claim 9, wherein the bottom portion provides support for the housing.

### Claim 12 (depends on 9)

The housing as recited in claim 9, further comprising:
a solid base portion.

### Claim 13 (depends on 12)

The housing as recited in claim 12, wherein the layered stack is bonded to the solid base portion.

### Claim 14 (depends on 9)

The housing as recited in claim 9, further comprising:
a component support structure disposed within the internal cavity and coupled with at least a portion of an interior facing surface of the housing.

### Claim 15 (depends on 14)

The housing as recited in claim 14, wherein at least a portion of the component support structure is formed of the material that fixes together the metal layers of the layered stack.

### Claim 16 (depends on 9)

The housing as recited in claim 9, wherein at least two adjacent layers of the metal layers are formed of an ultrasonically bondable material.

### Claim 17 (depends on 16)

The housing as recited in claim 16, wherein the ultrasonically bondable material is metal, a specially adapted paper or a thermoplastic material.

### Claim 18

A method of manufacturing a computing device, comprising:
forming a base portion that includes metal layers by bonding at least some of the metal layers by using metal to metal bonds, wherein the base portion includes an opening to an internal cavity defined at least in part by the bonded metal layers;
placing an operational component through the opening and into the internal cavity, wherein the base portion is capable of supporting the operational component; and
enclosing the operational component within the internal cavity by bonding additional metal layers to the base portion.

### Claim 19 (depends on 18)

The method as recited in claim 18, wherein the metal layers are bonded by an ultrasonic bonding process.

### Claim 20 (depends on 18)

The method as recited in claim 18, further comprising:
machining an outside surface of the base portion to form a seamless outer surface.