# US 10,118,381 B2 · Method and device for embossing of a nanostructure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,118,381 B2 - Document ID: US10118381B2 - Status: Granted - Kind: B2 - Application number: 15/113,111 - Filed: 2014-04-22 - Published: 2017-01-05 - Granted: 2018-11-06 - Earliest claimed: 2014-04-22 - Assignees: EV Group E. Thallner GmbH - Applicants: Ev Group E. Thallner GmbH - Inventors: Gerald Kreindl - Web page: https://patentgrep.com/patent/US10118381B2 ## CPC - B41F 19/02: with embossing - B30B 15/06: Platens or press rams - B44B 5/0052: {by pressing (B44B5/0061 and B44B5/0076 take precedence)} - B44B 5/026: {Dies (B44B5/028 takes precedence)} - B44C 1/24: Pressing or stamping ornamental designs on surfaces - G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping} - G03F 7/70733: {Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask} - G03F 7/70783: {Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight} - H10P 76/204: {of organic photoresist masks} - B41F: PRINTING MACHINES OR PRESSES (manifolding devices or office printing machines B41L) - B30B: PRESSES IN GENERAL (producing ultra-high pressure or ultra-high pressure and high temperature to effect modifications of a substance, e.g. for making artificial diamonds B01J3/00 ){(compressing means for refuse receptacles B65F1/1405)} - B44B: MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING (processes for producing decorative effects B44C; embossing leather C14B) - B44C: PRODUCING DECORATIVE EFFECTS (processes for applying liquids or other fluent materials to surfaces, in general B05D; shaping of plastics or substances in a plastic state B29C; printing processes to produce transfer pictures B41M3/12; thermographic duplication or marking methods B41M5/00); MOSAICS; TARSIA WORK (imitation of mosaic or tarsia work patterns B44F11/04); PAPERHANGING {(labels G09F; multi-step processes for making paper labels or tags B31D1/02)} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostructure punch and/or prestressing of the substrate by deformation of the substrate, b) making contact of a partial area of the punch surface with the nanostructure punch and c) automatic contacting of the remaining surface at least partially, especially predominantly, by the prestressing of the nanostructure punch and/or the prestressing of the substrate. ## Claims ### Claim 1 A method for embossing a nanostructure that is formed on a nanostructure punch into a punch surface of a curable material which has been applied to a substrate, the method comprising: aligning the nanostructure relative to the punch surface, holding and moving the nanostructure punch by means of a punch chucking apparatus; and embossing the punch surface with the nanostructure by A) prestressing the nanostructure punch by controlling a pin of the punch chucking apparatus to deform the nanostructure punch with pressure applied to a backside of the nanostructure punch by the pin, B) contacting a partial area of the punch surface with the nanostructure punch, and C) removing a peripheral edge of the nanostructure punch from the punch chucking apparatus while maintaining contact of the pin with the backside of the nanostructure punch, thereby automatically contacting a remaining surface of the punch surface in a controlled manner based on the prestressing of the nanostructure punch. ### Claim 2 (depends on 1) The method as claimed in claim 1, wherein the nanostructure punch is formed at least predominantly from at least one of the following UV-transparent materials: quartz, and/or silicon dioxide, and/or a polymer. ### Claim 3 (depends on 2) The method as claimed in claim 2, wherein the polymer is selected from the following group: polydimethylsiloxane, polytetrafluoroethylene, perfluorinated polyether, polyvinyl alcohol, polyvinyl chloride, and/or ethylene tetrafluoroethylene. ### Claim 4 (depends on 1) The method as claimed in claim 1, wherein an optical transparency of the nanostructure punch is greater than 0%. ### Claim 5 (depends on 4) The method as claimed in claim 4, wherein the optical transparency of the nanostructure punch is greater than 20%. ### Claim 6 (depends on 1) The method as claimed in claim 1, wherein the substrate is held, moved, and deformed by means of a substrate chucking apparatus. ### Claim 7 (depends on 6) The method as claimed in claim 6, wherein the pin acts orthogonally to the substrate chucking apparatus and a surface of the nanostructure punch. ### Claim 8 (depends on 1) The method as claimed in claim 1, wherein the method further comprises curing said curable material after complete contact has been made through the nanostructure punch. ### Claim 9 (depends on 8) The method as claimed in claim 8, wherein said curing includes the use of light. ### Claim 10 (depends on 1) The method as claimed in claim 1, wherein the punch chucking apparatus moves the nanostructure punch to a predetermined distance from the substrate before embossing the punch surface. ### Claim 11 (depends on 1) The method as claimed in claim 1, wherein the pin locally bends the nanostructure punch in order to define a first contact point with the curable material on the substrate, and wherein the partial area of the punch surface is comprised of the first contact point. ### Claim 12 (depends on 11) The method as claimed in claim 11, wherein, after the first contact point is reached, a pressure on vacuum tracks of the punch chucking apparatus is interrupted such that the nanostructure punch is released, and wherein, after the nanostructure punch is released, an embossing front runs independently over the punch surface. ### Claim 13 (depends on 1) The method as claimed in claim 1, further comprising, after the embossing: removing the nanostructure punch from the punch surface.