# US 10,118,255 B2 · Cutting method of a multilayer structure containing a brittle layer

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- Number: US 10,118,255 B2
- Document ID: US10118255B2
- Status: Granted
- Kind: B2
- Application number: 15/086,062
- Filed: 2016-03-31
- Published: 2016-10-06
- Granted: 2018-11-06
- Earliest claimed: 2015-03-31
- Assignees: Industrial Technology Research Institute; Nippon Electric Glass Co., Ltd.
- Applicants: Industrial Technology Research Institute; Nippon Electric Glass Co., Ltd.
- Inventors: Jyun-Kai Ciou; Yung-Min Hsieh; Kuo-Hsin Huang; Naotoshi Inayama; Takehiko Isomoto; Takahide Fujii; Chang-Ying Chen
- Web page: https://patentgrep.com/patent/US10118255B2

## CPC

- B23K 26/38: by boring or cutting
- C03B 33/0222: {Scoring using a focussed radiation beam, e.g. laser}
- C03B 33/07: Cutting armoured, {multi-layered, coated} or laminated, glass products
- C03B 33/074: {Glass products comprising an outer layer or surface coating of non-glass material}
- B23K 2103/54: {Glass}
- C03B 33/04: Cutting or splitting in curves, especially for making spectacle lenses
- Y02P 40/57: Improving the yield, e-g- reduction of reject rates
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- C03B: MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.

## Claims

### Claim 1

A cutting method of a multilayer structure containing a brittle layer, the cutting method comprising:
cutting the multilayer structure to form a cut edge;
removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and
modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.

### Claim 2 (depends on 1)

The cutting method according to claim 1, wherein modifying the edge of the brittle layer by the laser beam comprises:
causing the laser beam to strike the edge of the brittle layer adjacent to the cut edge so as to peel off a layer of chippings at the edge of the brittle layer.

### Claim 3 (depends on 2)

The cutting method according to claim 2, wherein the laser beam strikes at least one of a top surface and a bottom surface of the brittle layer, and the top surface and the bottom surface are arranged along a thickness direction of the brittle layer.

### Claim 4 (depends on 2)

The cutting method according to claim 2, wherein a spot of the laser beam on the brittle layer satisfies 0.5≤b/a≤2, where a is a diameter of the spot of the laser beam on a surface of the brittle layer, and b is the distance from the center of a focus of the laser beam to the edge of the brittle layer along a direction perpendicular to a thickness direction of the brittle layer.

### Claim 5 (depends on 2)

The cutting method according to claim 2 further comprising:
controlling a scanning path and a scanning speed of the laser beam striking on the brittle layer and allowing the laser beam to complete the scanning path.

### Claim 6 (depends on 5)

The cutting method according to claim 5, wherein scanning of the laser beam starts at a straight path segment or a convex path segment of the scanning path.

### Claim 7 (depends on 5)

The cutting method according to claim 5, wherein the scanning speed of the laser beam on a surface of the brittle layer ranges from 10 mm/s to 100 mm/s.

### Claim 8 (depends on 2)

The cutting method according to claim 2, wherein an average power of the laser beam on a surface of the brittle layer ranges from 1 W to 50 W.

### Claim 9 (depends on 2)

The cutting method according to claim 2, a diameter of a spot of the laser beam on a surface of the brittle layer ranges from 50 microns to 1000 microns.

### Claim 10 (depends on 1)

The cutting method according to claim 1, wherein the laser beam generates an strain area on the brittle layer along the edge of the brittle layer, and a strain propagates chippings at the edge of the brittle layer along the edge of the brittle layer, so as to peel off a layer of chippings at the edge of the brittle layer, thereby modifying the edge of the brittle layer.

### Claim 11 (depends on 1)

The cutting method according to claim 1, wherein the brittle layer is a glass layer or a ceramic layer.

### Claim 12 (depends on 1)

The cutting method according to claim 1, wherein the multilayer structure further contains an adhesive layer and a polymeric layer, and the adhesive layer is disposed between the brittle layer and the polymeric layer, and removing the material of the multilayer structure other than the brittle layer along the cut edge comprises removing a material of the adhesive layer and a material of the polymeric layer.

### Claim 13 (depends on 1)

The cutting method according to claim 1 further comprising:
disposing at least one protective film on at least one side of the multilayer structure before modifying the edge of the brittle layer by the laser.

### Claim 14 (depends on 13)

The cutting method according to claim 13, wherein the protective film is made of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), or a combination thereof.

### Claim 15 (depends on 1)

The cutting method according to claim 1, wherein a wavelength of the laser beam ranges from 3 microns to 12 microns.

### Claim 16 (depends on 1)

The cutting method according to claim 1, wherein a thickness of the brittle layer ranges from 1 micron to 1 millimeter.

### Claim 17 (depends on 1)

The cutting method according to claim 1, wherein a size of chippings at the edge of the brittle layer formed after cutting the multilayer structure is controlled so that a width of a layer of the chippings ranges from 1 microns to 2 millimeters.

### Claim 18 (depends on 1)

The cutting method according to claim 1, wherein a width of chippings at the edge of the brittle layer formed after cutting the multilayer structure is controlled to be smaller than twice a thickness of the brittle layer.

### Claim 19

A cutting method of a multilayer structure containing a brittle layer, the cutting method comprising:
cutting the multilayer structure to form a cut edge; and
causing a laser beam to strike an edge of the brittle layer adjacent to the cut edge so as to peel off a layer of chippings at the edge of the brittle layer, wherein a spot of the laser beam on the brittle layer satisfies 0.5≤b/a≤2, where a is a diameter of the spot of the laser beam on a surface of the brittle layer, and b is the distance from the center of a focus of the laser beam to the edge of the brittle layer along a direction perpendicular to a thickness direction of the brittle layer.

### Claim 20 (depends on 19)

The cutting method according to claim 19, wherein the laser beam generates an strain area on the brittle layer along the edge of the brittle layer, and a strain propagates chippings at the edge of the brittle layer along the edge of the brittle layer, so as to peel off the layer of chippings at the edge of the brittle layer, thereby modifying the edge of the brittle layer.

### Claim 21 (depends on 19)

The cutting method according to claim 19, wherein the brittle layer is a glass layer or a ceramic layer.

### Claim 22 (depends on 19)

The cutting method according to claim 19 further comprising:
disposing at least one protective film on at least one side of the multilayer structure before causing the laser beam to strike the edge of the brittle layer adjacent to the cut edge.