# US 10,118,246 B2 · Mounting apparatus

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- Number: US 10,118,246 B2
- Document ID: US10118246B2
- Status: Granted
- Kind: B2
- Application number: 15/632,570
- Filed: 2017-06-26
- Published: 2017-10-12
- Granted: 2018-11-06
- Earliest claimed: 2014-12-26
- Assignees: Shinikawa Ltd.
- Applicants: Shinkawa Ltd.
- Inventors: Shigeru Hayata; Hiroya Yuzawa; Yusuke Matsuki
- Web page: https://patentgrep.com/patent/US10118246B2

## CPC

- B23K 20/002: {specially adapted for particular articles or work (B23K20/129 takes precedence)}
- B23K 20/005: {Capillary welding}
- B23K 37/04: for holding or positioning work
- H10W 46/00: Marks applied to devices, e.g. for alignment or identification
- H10W 72/0198: {batch processes}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07178: {Means for aligning}
- H10W 72/07183: {Means for monitoring}
- H10W 72/07523: {Active alignment, e.g. using optical alignment using marks or sensors}
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 72/552: {comprising metals or metalloids, e.g. silver}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a bonding apparatus including a bonding stage 83 for heating a substrate (lead frame) 61 placed on the upper surface thereof or a semiconductor die 63 mounted on the substrate (lead frame) 61, an imaging device 20 arranged above the bonding stage 83 to image the substrate 61 placed on the bonding stage 83 or the semiconductor die 63 mounted on the substrate 61, and a standing wave generating device 35 for generating an ultrasonic standing wave in the space between the upper surface of the bonding stage 83 and the imaging device 20. This improves the accuracy of image position detection by the imaging device with a simple structure.

## Claims

### Claim 1

A mounting apparatus comprising:
a mounting stage for heating a bonding target placed on the upper surface thereof and an electronic component mounted on the bonding target;
an imaging device arranged above the mounting stage to image the bonding target placed on the mounting stage or the bonding target and the electronic component; and
a standing wave generating device for generating an ultrasonic standing wave in the space between the upper surface of the mounting stage and the imaging device.

### Claim 2 (depends on 1)

The mounting apparatus according to claim 1, wherein
the standing wave generating device includes an ultrasonic speaker and a reflection surface for reflecting an ultrasonic wave emitted from the ultrasonic speaker.

### Claim 3 (depends on 2)

The mounting apparatus according to claim 2, wherein
the reflection surface is a surface of a flat plate arranged in a manner opposed to the ultrasonic speaker.

### Claim 4 (depends on 3)

The mounting apparatus according to claim 3, wherein
the imaging device is movable in an XY direction, and wherein
the flat plate is arranged to move together with the imaging device in the XY direction.

### Claim 5 (depends on 4)

The mounting apparatus according to claim 4, wherein
the distance between the optical axis of the imaging device and the surface of the flat plate is (2n−1)/4 times (n is a positive integer) the wavelength λ of the ultrasonic wave so that an anti-node of the standing wave is positioned in the vicinity of the optical axis.

### Claim 6 (depends on 3)

The mounting apparatus according to claim 3, further comprising a wind clamper for pressing the bonding target or the surface of the bonging target on which the electronic component is mounted toward the mounting state, wherein
the flat plate is attached to the upper surface of the wind clamper in an end portion farther from the ultrasonic speaker.

### Claim 7 (depends on 2)

The mounting apparatus according to claim 2, wherein
the reflection surface is composed of a surface of a half mirror arranged in an inclined manner between the imaging device and the mounting stage and the surface of the bonding target placed on the mounting stage.

### Claim 8 (depends on 2)

The mounting apparatus according to claim 2, wherein
the reflection surface is composed of a surface of a curved mirror arranged in a manner opposed to the ultrasonic speaker and a surface of a flat plate arranged in a manner opposed to the curved mirror with the ultrasonic speaker and the mounting stage therebetween.

### Claim 9 (depends on 8)

The mounting apparatus according to claim 8, wherein
the curved mirror is a parabolic mirror or an ellipsoidal mirror.

### Claim 10 (depends on 1)

The mounting apparatus according to claim 1, wherein
the standing wave generating device includes two ultrasonic speakers arranged in a manner opposed to each other.

### Claim 11 (depends on 1)

The mounting apparatus according to claim 1, wherein
the standing wave generating device is a piezoelectric element arranged between the imaging device and the mounting stage to form a tube opened toward the mounting stage, and wherein
a standing wave region is formed between the opening and the upper surface of the mounting stage.

### Claim 12 (depends on 1)

The mounting apparatus according to claim 1, wherein
the bonding target is a substrate or a lead frame.