# US 10,118,222 B2 · Method and device for producing three-dimensional objects using laser technology and for applying an absorber using an inkjet method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,118,222 B2 - Document ID: US10118222B2 - Status: Granted - Kind: B2 - Application number: 14/717,122 - Filed: 2015-05-20 - Published: 2015-09-10 - Granted: 2018-11-06 - Earliest claimed: 2004-03-16 - Assignees: Evonik Degussa GmbH - Applicants: Sylvia Monsheimer; Maik Grebe; Rainer Goering; Franz-Erich Baumann - Inventors: Sylvia Monsheimer; Maik Grebe; Rainer Goering; Franz-Erich Baumann - Web page: https://patentgrep.com/patent/US10118222B2 ## CPC - B29C 64/153: using layers of powder being selectively joined, e.g. by selective laser sintering or melting - B22F 3/003: {Apparatus, e.g. furnaces (in general F27B)} - B22F 10/28: Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] - B22F 10/36: of energy beam parameters - B22F 12/41: characterised by the type, e.g. laser or electron beam - B23K 26/342: Build-up welding - B23K 26/703: {Cooling arrangements (by using a fluid stream B23K26/14)} - B28B 1/001: {Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material (selective deposition modelling of metallic powder B22F10/00; rapid manufacturing of 3D objects in general and in particular of plastics B29C64/00)} - B29C 64/40: Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof - C04B 35/64: Burning or sintering processes (C04B33/32 takes precedence {; powder metallurgy B22F}) - B22F 12/43: pulsed; frequency modulated - B22F 12/67: Blades - B29C 35/08: by wave energy or particle radiation {(B29C64/00, B29C71/04 take precedence)} - B29C 64/129: characterised by the energy source therefor, e.g. by global irradiation combined with a mask - B29C 64/165: using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber - B33Y 30/00: Apparatus for additive manufacturing; Details thereof or accessories therefor - Y02P 10/25: Process efficiency - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B28B: SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER (foundry moulding B22C; working stone or stone-like material B28D; shaping of substances in a plastic state, in general B29C; making layered products not composed wholly of these substances B32B) - C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE - B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract The present invention relates to a process for the bonding of material for the production of three-dimensional objects by selective heating via a laser of wavelength from 100 to 3000 nm. The beam spot may be a focused or unfocused beam spot, or may indeed be spread, as is the case with the diode laser, where the bars may have a stacked arrangement. The selectivity of the melting process is achieved via the application of an absorber to certain subregions of a layer composed of a pulverulent substrate, and then heating of the absorber by laser radiation of wavelength from 100 to 3000 nm. The heated absorber transfers the energy present therein to its surrounding pulverulent substrate, which is melted thereby and, after cooling, has firm cohesive bonding. ## Claims ### Claim 1 An apparatus for layer-by-layer production of a three-dimensional object, the apparatus comprising: a movable apparatus for layer-by-layer application of at least one pulverulent substrate to an operating platform or to a previously applied layer of a treated or untreated pulverulent substrate which may be present on the operating platform; an apparatus movable in the x, y plane configured to apply a material comprising an absorber that absorbs laser radiation having a wavelength within a range from 100 to 3,000 nm, and optionally at least one other additive, to selected regions of a layer of the pulverulent substrate; and an energy source comprising a laser emitting radiation having a wavelength within a range from 100 to 3,000 nm, wherein: the energy source is an unfocused laser beam directed to an entire powder surface applied to the operating platform or to the previously applied layer; the unfocused laser beam is directed to the entire powder surface at an irradiation velocity from 10 to 10,000 mm/s; and the laser is a diode laser in which the unfocused laser beam includes beams having a rectangular area. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the energy source is a diode laser emitting radiation having a wavelength within a range from >2,100 to 3,000 nm. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the wavelength is within a range from 800 to 1,070 nm. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the wavelength is within a range from 1,900 to 2,100 nm. ### Claim 5 (depends on 1) The apparatus of claim 1, further comprising a storage vessel for an initial charge of untreated pulverulent substrate. ### Claim 6 (depends on 1) The apparatus of claim 1, further comprising a temperature control unit. ### Claim 7 (depends on 1) The apparatus of claim 1, further comprising a cooling unit. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein the laser beam is the only laser source. ### Claim 9 (depends on 1) The apparatus of claim 1, wherein the pulverulent substrate does not absorb, or insufficiently absorbs, the laser radiation compared to the material comprising the absorber. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein the absorber absorbs laser radiation and dissipates absorbed energy in the form of heat to a surrounding substrate, thereby bonding, via fusion or sintering, regions of the substrate in the applied layer or layer(s). ### Claim 11 (depends on 1) The apparatus of claim 1, further comprising an ink jet printer head or a printing head employing a piezoelectric effect or a bubble-jet principle. ### Claim 12 (depends on 1) The apparatus of claim 1, further comprising a controller for controlling selective application of the material comprising the absorber. ### Claim 13 (depends on 1) The apparatus of claim 1, further comprising: an operating platform or a substrate comprising regions of laser treated pulverulent substrate and regions of untreated pulverulent substrate; and, optionally an apparatus for removing the untreated pulverulent substrate. ### Claim 14 (depends on 1) The apparatus of claim 1, further comprising: an operating platform or a substrate comprising regions of laser treated pulverulent substrate and regions of untreated pulverulent substrate; and an apparatus for removing the untreated pulverulent substrate. ### Claim 15 (depends on 14) The apparatus of claim 14, wherein the apparatus for removing the untreated pulverulent substrate is a sieving apparatus.