Compact three-dimensional memory device having a seal ring and methods of manufacturing the same
AssigneeSanDisk Technologies LLC
InventorJunichi Ariyoshi
Life of this patent
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AssigneeSanDisk Technologies LLC
InventorJunichi Ariyoshi
Estimating the term…
A semiconductor die includes a pair of first alternating stacks of first portions of insulating layers and electrically conductive layers located over a semiconductor substrate, groups of memory stack structures vertically extending through a respective one of the pair of the first alternating stacks, a pair of second alternating stacks of second portions of the insulating layers and dielectric material layers laterally adjoined to a respective one of the first alternating stacks, such that each second portion of the insulating layers is connected to a respective one of the first portions of the insulating layers, and at least one seal ring structure laterally enclosing, and laterally spaced from, the pair of first alternating stacks, and contacting at least a first sidewall of each of the pair of second alternating stacks.
A semiconductor die, comprising:
A method of manufacturing a semiconductor die, comprising:
Dependencies are inferred from the claim text.