Multi-terminal device packaging using metal sheet
AssigneeSensor Electronics Technology, Inc.
InventorsYuri Bilenko, Michael Shur, Remigijus Gaska, Alexander Dobrinsky
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Abstract
A solution for packaging a two terminal device, such as a light emitting diode, is provided. In one embodiment, a method of packaging a two terminal device includes: patterning a metal sheet to include a plurality of openings; bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact.
Claims20
A device package array comprising:
- a wafer including a plurality of devices;
- a first metal sheet located adjacent to the wafer, wherein the first metal sheet is patterned to include a plurality of openings extending through the first metal sheet;
- and
- a second metal sheet located adjacent to the first metal sheet, wherein the second metal sheet is patterned to include a plurality of openings extending through the second metal sheet, wherein the first metal sheet and the second metal sheet are positioned such that the plurality of openings in the first metal sheet alternate with the plurality of openings in the second metal sheet, such that a first electrode in each device of the plurality of devices is bonded to the first metal sheet and a second electrode in each device of the plurality of devices is bonded to the second metal sheet.
A device package array comprising:
- a wafer including a plurality of devices;
- a first metal sheet located adjacent to the wafer, wherein the first metal sheet is patterned to include a plurality of openings extending through the first metal sheet;
- a second metal sheet located adjacent to the first metal sheet, wherein the second metal sheet is patterned to include a plurality of openings extending through the second metal sheet, wherein the first metal sheet and the second metal sheet are positioned such that the plurality of openings in the first metal sheet alternate with the plurality of openings in the second metal sheet, such that a first electrode in each device of the plurality of devices is bonded to the first metal sheet and a second electrode in each device of the plurality of devices is bonded to the second metal sheet;
- and
- an insulating material located between the first metal sheet and the second metal sheet.
A device package array comprising:
- a wafer including a plurality of devices, wherein each device includes a substrate and an encapsulant located over the substrate;
- a first metal sheet located adjacent to the wafer, wherein the first metal sheet is patterned to include a plurality of openings extending through the first metal sheet;
- a second metal sheet located adjacent to the first metal sheet, wherein the second metal sheet is patterned to include a plurality of openings extending through the second metal sheet, wherein the first metal sheet and the second metal sheet are positioned such that the plurality of openings in the first metal sheet alternate with the plurality of openings in the second metal sheet, such that a first electrode in each device of the plurality of devices is bonded to the first metal sheet and a second electrode in each device of the plurality of devices is bonded to the second metal sheet;
- and
- an insulating material located between the first metal sheet and the second metal sheet.
Dependencies are inferred from the claim text.