US 10,115,623 B2Granted

Substrate processing apparatus

AssigneeSCREEN Holdings Co., Ltd.

InventorsNoriyuki Kikumoto, Kazuhiro Honsho

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Abstract

In a substrate processing apparatus, a shield plate includes a first chucking magnetic material (441). The shield plate is moved up and down by a chamber opening-and-closing mechanism. A substrate holding part includes a movable chuck member (412) and a fixed chuck member. The movable chuck member (412) includes a second chucking magnetic material (442). When the shield plate is moved down, the shield plate comes in close proximity to the upper surface of a substrate (9), and the first chucking magnetic material (441) comes in close proximity to the second chucking magnetic material (442). The substrate (9) is held by magnetic action between the first chucking magnetic material (441) and the second chucking magnetic material (442). It is thus possible to hold the substrate (9) with a simple structure.

Claims9

Dependent claims

A substrate processing apparatus for processing a substrate, comprising:

a substrate holding part for holding a substrate;
a substrate rotation mechanism for rotating said substrate holding part about a central axis perpendicular to said substrate;
and
a magnetic-material movement mechanism for moving a first chucking magnetic material into close proximity to said substrate holding part and moving said first chucking magnetic material away from said substrate holding part,
wherein said substrate holding part includes:
a chuck support part;
and
at least three chuck members supported on said chuck support part,
said at least three chuck members includes at least one movable chuck member whose position can be changed between a chuck position and an unchuck position,
each movable chuck member included in said at least one movable chuck member includes a second chucking magnetic material that applies a force that holds an outer edge portion of said substrate on said each movable chuck member by magnetic action between said first chucking magnetic material and said second chucking magnetic material when said first chucking magnetic material is moved into close proximity to said substrate holding part, and
said substrate rotation mechanism includes:
a rotor that has an annular shape centered about said central axis and includes a permanent magnet;
and
a stator that has an annular shape centered about said central axis and rotates said rotor that is in a floating state.

11 more elements

A substrate processing apparatus for processing a substrate, comprising:

a substrate holding part for holding a substrate;
a substrate rotation mechanism for rotating said substrate holding part about a central axis perpendicular to said substrate;
and
a magnetic-material movement mechanism for moving a first chucking magnetic material into close proximity to said substrate holding part and moving said first chucking magnetic material away from said substrate holding part,
wherein said substrate holding part includes:
a chuck support part;
and
at least three chuck members supported on said chuck support part,
said at least three chuck members includes at least one movable chuck member whose position can be changed between a chuck position and an unchuck position,
each movable chuck member included in said at least one movable chuck member includes a second chucking magnetic material that applies a force that holds an outer edge portion of said substrate on said each movable chuck member by magnetic action between said first chucking magnetic material and said second chucking magnetic material when said first chucking magnetic material is moved into close proximity to said substrate holding part, and
each movable chuck member included in said at least one movable chuck member is turnable about a turning axis, and
a force that turns said each movable chuck member in a direction for holding said substrate is exerted on said each movable chuck member by a centrifugal force produced by rotation of said substrate holding part.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/867,204Filed 10 Jan 2018 · continuation
Priority: JP 2014-06448826 Mar 2014
Published: US 2018/0130695 A110 May 2018
Granted: 30 Oct 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10P 72/7624
The wafers being placed on a susceptor, stage or support: characterised by the mechanical construction of the susceptor, stage or support
B23B 31/142
Involving the use of centrifugal force: to grip a tool or workpiece
B23B 31/18
Chucks with simultaneously-acting jaws, whether or not also individually adjustable: pivotally movable in planes containing the axis of the chuck
H10P 72/7608
The wafers being placed on a susceptor, stage or support: characterised by a plurality of separate clamping members, e.g. clamping fingers

Family

Application14/665,468Parent of this continuation · filed 23 Mar 2015
US 2018/0130695 A1Pre-grant publication · published 10 May 2018
US 9,947,572 B2Parent of this continuation
US 2015/0279721 A1Published application
US 10,115,623 B2This patent

From the US filing history. Foreign family members aren’t listed.