A method for eliminating or substantially reducing process-inhibiting vibrations within a high-precision semiconductor device fabrication facility, comprising the steps of:
- supporting a high-precision semiconductor device fabrication equipment on a hybrid tool pedestal system within a building having a building structure susceptible to vibration transmission and that may be exposed to and susceptible to transmitting process inhibiting vibrations to said high-precision semiconductor device fabrication equipment, wherein said hybrid tool pedestal system comprises a multi-layered material construction formed of materials selected for isolating varying vibration frequencies by virtue of the combined isolation of said multi-layered material construction;
- positioning said hybrid tool pedestal system on a raised floor, said raised floor for structurally separating a building floor from said hybrid tool pedestal system for providing a first portion of vibration isolation between the high-precision semiconductor device fabrication equipment and the building floor, said hybrid tool pedestal system comprising a plurality of base structures for positioning said hybrid tool pedestal system on said raised floor and an elevated structure for providing structural support and separating a high-precision semiconductor device fabrication equipment positioned on said elevated structure from said plurality of base structures;
- separating said plurality of base structures from said raised floor using a plurality of first vibration isolation pads, said plurality of first vibration isolation pads comprising an adhesive pad, caulking, or a combination of adhesive pads and caulking;
- positioning a plurality of first vertical support structures as a portion of said elevated structure and separating an upper structure of said elevated structure from at least selected ones of said plurality of base structures, said selected ones of said plurality of first vertical support structures further comprising a hollow portion capable of being filled;
- filling at least a subset of said hollow portions with a vibration absorbing foam, said vertical support structure separating said base from said upper surface and further comprising concrete mix to reduce/isolate vibration and improve stiffness thereby absorbing vibrations transmitted to said first vertical support structures;
- separating said plurality of first vertical support structures from said upper structure using a second vibration isolation pad comprising an adhesive pad, caulking, or a combination of adhesive pads and caulking;
- wherein said first vibration isolation pads, said vibration absorbing foam, and said second vibration isolation pad coordinate to eliminate or substantially reduce the ability of vibrations from the building floor to reach high-precision semiconductor device fabrication equipment operating on said upper structure;
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- further separating said second isolation pad from said upper structure using a vertical structural beam, said vertical structural beam connecting to said upper structure at a first joint and to said second isolation pad at a second joint;
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- applying a vibration frequency isolation structure in the form of either an adhesive pad, caulking, or a combination of adhesive pad and caulking at said first joint for vibration isolating said upper structure from said vertical structural beam and at said second joint for vibration isolating said vertical structural beam from said second isolation pad for further preventing vibration isolating said semiconductor device fabrication process inhibiting vibrations at the building floor from affecting precision operation of the high-precision semiconductor device fabrication equipment on said upper structure, and
- associating a heavy mass block between said plurality of base structures and said raised floor for vibration and sound reduction said heavy mass block comprising a first layer of sound dampening adhesive, a reinforced concrete block connecting to said first layer of sound dampening adhesive, a second layer of sound dampening adhesive position on said reinforced concrete block opposite said first layer of sound dampening adhesive, and a block of porous high strength metal connecting to said second layer of sound dampening adhesive, said first layer of sound dampening adhesive positioned between a clean room floor and said reinforced concrete block for first reducing in the vibration induced deflection from the clean room floor to said concrete block, said second layer of sound dampening adhesive for further reducing deflection transmitted from said reinforced concrete block to said porous high strength metal block, wherein deflection and vibration carried from a waffle concrete floor to the high-precision semiconductor device fabrication equipment becomes effectively isolated;
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- further providing on said heavy mass block an electromagnetic interference (EMI) barrier for insulating or absorbing EMI for preventing EMI frequencies from adversely affecting operation of the high-precision semiconductor device fabrication equipment and further performing a degaussing step on said high-precision semiconductor device fabrication equipment for removing magnetic arc blow associated with said EMI barrier.