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US 10,106,932 B2Granted
Substrate for wallboard joint tape and process for making same
AssigneeInternational Paper Company
InventorsDennis W. Anderson, James E. Sealey
Life of this patent
Estimating the term…
Abstract
A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.
Claims26
A method of making a multi-ply paper substrate, comprising
- using an air-laid papermaking machine, forming at least two layers, contacting one or both of the layers with an adhesive, and contacting the layers with one another, to form a two-layered web;
- and
- compressing the two-layered web, to make the paper substrate, the multi-ply paper comprising
- at least three adjoining plies, wherein at least two plies are bonded to one another by an adhesive therebetween, the adhesive being selected from the group consisting of starch, cooked starch, and adhesive starch;
- a basis weight of 80-200 gsm;
- an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541;
- an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494;
- a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494;
- and
- wherein at least one of said plies has an internal bond higher than that of the other of said plies, the adhesive, or both the adhesive and the other said plies.
7 more elements
Dependencies are inferred from the claim text.