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US 10,104,816 B2Granted
Board, semiconductor fabrication plant (FAB) and fabrication facility
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChwen Yu, Chih-Ming Tsao
Life of this patent
Estimating the term…
Abstract
A board includes a first magnetic conductive plate and a second magnetic conductive plate. The first magnetic conductive plate has a first magnetic conductive direction. The second magnetic conductive plate overlaps with the first magnetic conductive plate. The second magnetic conductive plate has a second magnetic conductive direction. The first magnetic conductive direction and the second magnetic conductive direction cross.
Claims9
A board, comprising:
- a first magnetic conductive plate having a first magnetic conductive direction;
- and
- a second magnetic conductive plate overlapping with the first magnetic conductive plate, the second magnetic conductive plate having a second magnetic conductive direction, wherein the first magnetic conductive direction and the second magnetic conductive direction cross.
Dependencies are inferred from the claim text.