Method for making a circuit board

A method for making a circuit board comprising:

• providing a silver clad laminate, the silver clad laminate comprising a substrate and two silver foils attached to two opposite surfaces of the substrate, each of the two silver foils comprising a first area and a second area;
• forming at least one through hole on the silver clad laminate, the through hole comprising an annular side wall, the annular side wall comprising an annular middle wall and two annular edge walls connected to two sides of the annular middle wall, the annular middle wall being a surface of the substrate, each of the two annular edge walls being a surface of a silver foil;
• forming an organic conductive film on the annular middle wall;
• forming a dry film pattern layer on a surface of the second area away from the substrate to obtain an intermediate product;
• plating copper on the intermediate product to form a copper circuit layer on a surface of the first area away from the substrate and to form a via hole in the through hole;
• removing the dry film pattern layer from the second area of the silver foil to expose the surface of the second area away from the substrate;
• etching the second area of the silver foil away by an etchant and the first area defining to be a silver circuit layer, the silver circuit layer being between the substrate and the copper circuit layer, the copper circuit layer and the silver circuit layer defining a conductive circuit layer.