Integrated circuit package with radio frequency coupling structure

A radio frequency device comprising:

• an integrated circuit package comprising a radio frequency coupling structure arranged inside the integrated circuit package, the radio frequency coupling structure comprising:
• an electrically conductive material, the electrically conductive material having a cavity surrounded by side walls of the electrically conductive material, the cavity having at least one opening;
• a first electrically isolating layer having a first side in contact with the side walls of the electrically conductive material and with the opening of the cavity facing the first side of the first electrically isolating layer such that only the side walls of the electrically conductive material are in direct contact with the first electrically isolating layer, and the first electrically isolating layer having a second side opposite to the first side;
• a second electrically isolating layer stacked at the second side with at least the first electrically isolating layer and having a third side arranged at a package side of the integrated circuit package;
• an integrated antenna structure for at least one of transmitting and receiving a radio frequency signal, the integrated antenna structure being arranged between the first electrically isolating layer and the second electrically isolating layer with the opening of the cavity facing the integrated antenna structure;
• the electrically conductive material being encapsulated by a dielectric material, the electrically conductive material being arranged to partly overlap the integrated antenna structure and being separated from the integrated antenna structure by at least the first electrically isolating layer, the electrically conductive material being arranged to reflect the radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer to the package side;
• and
• a printed circuit board (PCB), the package side of the integrated circuit package being mounted on the PCB, wherein the PCB has a hollow radio frequency waveguide formed therein via a hole extending through the entire thickness of the PCB, the hole having lateral walls covered by an electrically conductive layer, the hole extending to an area of the radio frequency coupling structure partly overlapping the integrated antenna structure, and wherein the integrated circuit package is electrically coupled to the radio frequency waveguide and the radio frequency waveguide is configured to guide the radio frequency signal out of a plane parallel to a surface of the first electrically isolating layer at the first side.