Method for joining ceramic to metal, and sealing structure thereof

A method for sealing a high temperature thermal electrochemical cell, comprising:

• disposing a metallization layer comprising molybdenum on a portion of an alumina component;
• disposing a metallic layer comprising nickel and a melting point depressant on the metallization layer by a screen printing process;
• sintering the metallic layer at a temperature less than about 1000 degrees Celsius to form a metallic barrier layer, wherein the metallic barrier layer has a porosity higher than about 25 percent by volume and comprises nickel and a melting point depressant;
• and
• joining the portion of the alumina component to a nickel-containing metal component by brazing through the metallization layer and the metallic barrier layer.

A sealing structure, comprising:

• a metallized ceramic component;
• a metallic barrier layer disposed on the metallized ceramic component by a screen printing process and subsequently sintered at less than about 1000 degrees Celsius, wherein the metallic barrier layer comprises nickel and a melting point depressant;
• a metal component bonded to the metallized ceramic component through the metallic barrier layer;
• and
• a braze material disposed between the metallic barrier layer disposed on the metallized ceramic component and a surface of the metal component.