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US 10,100,231 B2Granted
Adhesive having structural integrity and insulative properties
AssigneeHenkel IP & Holding GmbH
InventorsTianjian Huang, Robert Sandilla, Daniel Waski, Kristina Thompson, John Meccia
Life of this patent
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Abstract
An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.
Claims11
An article comprising a first substrate, a second substrate, and an adhesive composition interposed between the two substrates comprising:
- (a) about 50 to about 99.9 weight percent, on a dry weight basis, of an emulsion-based polymer selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate-ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane and mixtures thereof;
- (b) about 0.1 to about 10 weight percent, on a dry weight basis, of a plurality of expandable microspheres;
- (c) water;
- and
- (d) optionally, plasticizer and/or preservative;
- wherein the volume of the microspheres is greater than 200% in the dry adhesive upon expanding the microsphere.
3 more elements
Dependencies are inferred from the claim text.