Attachment of structures having different physical characteristics

A method of bonding a first structure to a second structure, the first structure being non-metallic, the method comprising:

• providing the first and second structures wherein the first structure is a composite comprising a polymeric material selected from the group consisting of polyetherimide (PEI), polyimide, polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polysulfone, nylon, polyphenylsulfide, polyester, condensation polyimides, addition polyimides, epoxy cured with aliphatic and/or aromatic amines and/or anhydrides, cyanate esters, phenolics, polyesters, polybenzoxazine, polyurethanes, polyacrylates, polymethacrylates, and thermoset silicones;
• coating a portion of the first structure with a metal to provide a metal-coated portion;
• applying at least one intermediate material on the metal-coated portion;
• and
• bonding the metal-coated portion of the first structure and the intermediate material to the second structure, wherein the first and second structures have different coefficients of thermal expansion (CTEs) and the intermediate material has a CTE that falls between the CTEs of the first and second structures;
• wherein the bonding is a process selected from the group consisting of transient liquid phase (TLP) bonding and partial transient liquid phase (PTLP) bonding.