Double insulated heat spreader
AssigneeEnphase Energy, Inc.
InventorRyan Linderman
Life of this patent
Estimating the term…
Abstract
An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.
Claims20
An apparatus for thermal management for an electric device, comprising:
- an enclosure formed from an electrically insulating material, wherein the enclosure contains a printed circuit board (PCB) populated with at least one electrical component;
- a primary heat spreader disposed within the enclosure, wherein the primary heat spreader is thermally conductive and is thermally coupled to the enclosure, and wherein the primary heat spreader comprises a first portion and a second portion that are galvanically isolated from one another;
- and
- a thermal interface coupled between the primary heat spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.
A power conversion apparatus with thermal management, comprising:
- a power converter comprising:
- a power converter enclosure formed from an electrically insulating material, the power converter enclosure containing a printed circuit board (PCB) populated with at least one electrical component;
- a primary heat spreader comprising a first portion and a second portion that are galvanically isolated from one another, the primary heat spreader disposed within the power converter enclosure, wherein the primary heat spreader is thermally conductive and is thermally coupled to the power converter enclosure;
- and
- a thermal interface coupled between the primary head heat spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.
Dependencies are inferred from the claim text.