Device for signature adaptation and object provided with device for signature adaptation
AssigneeBAE Systems Hägglunds Aktiebolag
InventorsPeder Sjölund, Jussi Myllyluoma
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Abstract
The invention pertains to a device for signature adaptation, comprising a surface element arranged to assume a determined thermal distribution, wherein said surface element comprises at least one temperature generating element arranged to generate at least one predetermined temperature gradient to a portion of a first heat conducting layer of said surface element, characterized in that said device for signature adaptation comprises a liquid cooling element arranged to provide at least one liquid flow, thermally contacting an inner portion of said at least one temperature generating element so that thermal energy is dispersed from said at least one temperature generating element.
Claims24
A device for signature adaptation, comprising:
- a surface element arranged to assume a determined thermal distribution, wherein said surface element comprises a plurality of temperature generating elements, each having an outer portion arranged to generate a predetermined temperature gradient to a portion of a plurality of portions of a first heat conducting layer of said surface element;
- and
- a liquid cooling element arranged to provide at least one liquid flow, thermally contacting an inner portion of each of the temperature generating elements so that thermal energy is dispersed from the inner portion of each of the temperature generating elements in order to generate the predetermined temperature gradient to the portion of the plurality of portions of the first heat conducting layer, further wherein:
- the liquid cooling element comprises a liquid cooling element layer, inwardly of the first heat conducting layer,
- the liquid cooling element layer comprises a plurality of apertures arranged to receive the plurality of temperature generating elements so that the plurality of temperature generating elements thermally contacts a portion of a heat plate structure, and
- the heat plate structure is arranged inwardly of and facing the liquid cooling element layer and arranged to disperse the thermal energy from the plurality of temperature generating elements in a direction along the surface of the heat plate structure.
Dependencies are inferred from the claim text.