Printed circuit board with edge soldering for high-density packages and assemblies

An integrated circuit assembly, or IC assembly, comprising at least two IC packages, each according to the IC package including a printed circuit board (PCB) and an integrated circuit chip, or IC chip, mounted on the PCB, the PCB comprising:

• two opposite main surfaces, each delimited by lateral edges;
• and lateral surfaces, each meeting each of the main surfaces at one of the lateral edges, the PCB further comprising:
• a row of solder pads extending along a lateral edge of the PCB, with each solder pad of the row formed directly at said lateral edge and/or directly on one of the lateral surfaces meeting one of the two main surfaces at said lateral edge;
• and a main surface of the IC chip facing and electrically connecting one of the two main surfaces of the PCB, and a main surface of one of the at least two IC packages parallel to and facing a main surface of another one of the at least two IC packages, wherein each PCB of the at least two IC packages is edge-soldered to a same board via a respective row of solder pads formed directly at a lateral edge and/or directly on one lateral surface of said each PCB, and said IC assembly further comprising:
• a third integrated circuit package, or third IC package, between each of said at least two IC packages, wherein the third integrated circuit package comprises a printed circuit board, or PCB, and an integrated circuit chip, or IC chip, mounted on the PCB of the third IC package, a main surface of the IC chip of the third IC package facing and electrically connecting a main surface of the PCB of the third IC package, and a heat dissipating structure comprising one or more thermally conducting layers, each intercalated between an IC package and an adjacent IC package of the IC assembly, wherein one thermally conducting layer provides mechanical and direct thermal contact with a surface of an IC chip of a first IC package and a main non-conducting surface of the adjacent IC package.