US 10,098,236 B2Granted

Use of combined masking techniques and/or combined material removal techniques to protectively coat electronic devices

AssigneeHZO, Inc.

InventorsVimal Kumar Kasagani, Colin LaMar Loose, Tyler Christensen Child, Caleb Edward Kanavel, Heidi L. Popeck, Samuel R. Anderson, Cameron LaMar Loose, Xiaowei Shen

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Abstract

Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.

Claims8

Dependent claims

A method for applying a protective coating to an electronic device, comprising:

applying a protective coating to selected areas of an electronic device comprising features and components, wherein applying the protective coating to the selected areas of the electronic device comprises masking the electronic device in areas of the electronic device other than the selected areas, coating the electronic device and de-masking the electronic device,
wherein the masking the electronic device includes:
applying flat preformed elements to flat features and/or components of the electronic device;
applying a fluid masking material to at least some of the features and/or the components of the electronic device that protrude from the electronic device:
and
applying a non-hardenable semisolid masking material around at least one of said components that protrudes from a daughter board of the electronic device and/or within a receptacle of at least one of the components carried by the electronic device.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/836,875Filed 26 Aug 2015 · us provisional application
Priority: 26 Aug 2014
Published: US 2016/0345440 A124 Nov 2016
Granted: 9 Oct 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification28 codes

H10W 74/01
Encapsulations, e.g. protective coatings: manufacture or treatment
B05B 12/24
Masking elements, i.e. elements defining uncoated areas on an object to be coated: made at least partly of flexible material, e.g. sheets of paper…
B05B 12/26
Masking elements, i.e. elements defining uncoated areas on an object to be coated: for masking cavities
B05D 1/32
Processes for applying liquids or other fluent materials: using means for protecting parts of a surface not to be coated, e.g. using stencils, resists

Family

Application62/041,752Us provisional application · filed 26 Aug 2014
Application62/042,921Us provisional application · filed 28 Aug 2014
Application62/048,904Us provisional application · filed 11 Sep 2014
US 2016/0345440 A1Pre-grant publication · published 24 Nov 2016
US 10,098,236 B2This patent

From the US filing history. Foreign family members aren’t listed.