Manufacturing method of circuit board

A manufacturing method of a circuit board, comprising:

• providing a dielectric substrate;
• forming a circuit pattern on the dielectric substrate;
• forming a dielectric layer on the dielectric substrate, and the dielectric layer covers the circuit pattern and has a hole or a conductive via in the dielectric layer, wherein the hole exposes a portion of the circuit pattern and the conductive via is electrically connected to the circuit pattern;
• forming a conductive seed layer in the hole and on the dielectric layer;
• forming a photoresist layer on the conductive seed layer;
• performing imprinting on the photoresist layer via a piezochromic stamp, wherein when a pressing side of the piezochromic stamp facing the conductive seed layer is in contact with the conductive seed layer in the imprinting process, a light transmittance effect of the pressing side is changed from allowing a light having a specific wavelength to pass through to blocking the light having the specific wavelength, or the light transmittance effect of the pressing side is changed from blocking the light having the specific wavelength to allowing the light having the specific wavelength to pass through;
• performing exposure on the photoresist layer by using the piezochromic stamp as a mask;
• removing the piezochromic stamp and performing development on the photoresist layer to form a patterned photoresist layer;
• forming a patterned metal layer on the conductive seed layer exposed by the patterned photoresist layer;
• and
• removing the patterned photoresist layer and the conductive seed layer located under the patterned photoresist layer.