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AssigneeMurata Manufacturing Co., Ltd.
InventorsYoichi Takagi, Tadashi Nomura, Masato Yoshida, Nobuaki Ogawa, Mitsuhiro Matsumoto
Estimating the term…
To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.
A module comprising:
A module component mounted on a mounting board, the module component comprising:
A method of manufacturing a module, the method comprising:
Dependencies are inferred from the claim text.