Electronic component device and method for manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorMasahiro Kyozuka
Life of this patent
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Abstract
An electronic component device includes a cored wiring substrate, an electronic component, a reinforcing layer, a connection terminal, and sealing resin. The cored wiring substrate includes a core layer. The electronic component is mounted on the cored wiring substrate. The coreless wiring substrate is disposed on the cored wiring substrate and the electronic component. The reinforcing layer is provided in the coreless wiring substrate and in a region corresponding to the electronic component. The connection terminal connects the cored wiring substrate and the coreless wiring substrate. The sealing resin is filled between the cored wiring substrate and the coreless wiring substrate.
Claims8
An electronic component device comprising:
- a cored wiring substrate comprising a core layer;
- an electronic component that is mounted on the cored wiring substrate;
- a coreless wiring substrate that is disposed above the cored wiring substrate and the electronic component such that the coreless wiring substrate is spaced from the cored wiring substrate and the electronic component;
- a connection terminal that connects the cored wiring substrate and the coreless wiring substrate;
- and
- a sealing resin that is filled between the cored wiring substrate and the coreless wiring substrate,
- wherein the coreless wiring substrate comprises an insulating layer, a wiring layer, and a reinforcing layer, the reinforcing layer being embedded in the insulating layer and provided in a region overlaying the electronic component, the insulating layer comprising a first surface and a second surface opposite to the first surface, the first surface of the insulating layer being opposed to the electronic component, and a surface of the reinforcing layer being flush with the second surface of the insulating layer.
Dependencies are inferred from the claim text.